From WikiChip
Difference between revisions of "zettascaler"

(Overview)
Line 4: Line 4:
 
== Overview ==
 
== Overview ==
 
ZettaScaler supercomputers are constructed using dense server aggregates called 'Bricks'. The system is cooled using enclosures containing a number of bricks. The cooling system is designed by ExaScaler and makes use of 3M's Fluorinert Electronic liquid which is an electrically insulating fluorocarbon-based inert liquid.
 
ZettaScaler supercomputers are constructed using dense server aggregates called 'Bricks'. The system is cooled using enclosures containing a number of bricks. The cooling system is designed by ExaScaler and makes use of 3M's Fluorinert Electronic liquid which is an electrically insulating fluorocarbon-based inert liquid.
 +
 +
ZettaScalers use a host CPU (typically a {{intel|Xeon E5}}) which is then used to offload work to the {{pezy|PEZY-SCx}} processors which act as GPDSP/GPGPU accelerators using OpenCL-like programming called PZCL.
  
 
=== ZettaScaler-1.x ===
 
=== ZettaScaler-1.x ===

Revision as of 01:55, 2 November 2017

ZettaScaler is a series of Japanese supercomputers using processors designed by PEZY and liquid cooling systems designed by ExaScaler.

Overview

ZettaScaler supercomputers are constructed using dense server aggregates called 'Bricks'. The system is cooled using enclosures containing a number of bricks. The cooling system is designed by ExaScaler and makes use of 3M's Fluorinert Electronic liquid which is an electrically insulating fluorocarbon-based inert liquid.

ZettaScalers use a host CPU (typically a Xeon E5) which is then used to offload work to the PEZY-SCx processors which act as GPDSP/GPGPU accelerators using OpenCL-like programming called PZCL.

ZettaScaler-1.x

ZettaScaler-1.x (ZS-1.x) is based on the PEZY-SC. Each node (brick) was constructed using two Xeon E5 connected using Intel's QPI along with 4 set of dual PEZY-SC chips in PCIe card slots using InfiniBand FDR HCA. The use of the general-purpose Intel chips was to reduce cost and speedup development cycle. The original ZS-1.0 used an off-the-shelf SuperMicro board in order to speed-up the development cycle. Starting with the ZS-1.4, PEZY moved to a custom "brick".

With the introduction of the ZS-1.6, PEZY redesigned the package of the PEZY-SC. The new chip, PEZY-SCnp (NP for New Package), addressed a number of issues relating to signal quality (DRAM, and PCIe frequency failure).

System ZettaScaler-1.0 ZettaScaler-1.4 ZettaScaler-1.5 ZettaScaler-1.6
Introduction October 2014 April 2015 October 2015 April 2016
Board SuperMicro Board Brick
Host 2x Xeon E5-2660 v2 2x Xeon E5-2618L v3
Chip PEZY-SC PEZY-SCnp
Memory DDR3 256 GB DDR4 64 GB DDR4 128 GB
TOP500 Suiren:
187 TFLOPS (Rank 369) 2014/11
206 TFLOPS (Rank 366) 2015/06
Shoubu:
412 TFLOPS (Rank 169) 2015/06
SuirenBlue:
194 TFLOPS (Rank 392) 2015/06
Shoubu:
1,001 TFLOPS (Rank 94) 2016/06
Satsuki: 290 TFLOPS (Rank 486) 2016/06
Green500 Suiren:
4.95 GFLOPS/W (Rank 2) 2014/11
6.22 GFLOPS/W (Rank 3)
Shoubu:
7.03 GFLOPS/W (Rank 1) 2015/06
SuirenBlue: 6.84 GFLOPS/W (Rank 2) 2015/06
Shoubu:
6.67 GFLOPS/W (Rank 1) 2016/06
Satsuki 6.20 GFLOPS/W (Rank 2) 2016/06

ZettaScaler-2.x

With the introduction of the ZettaScaler-2.x, PEZY has redesigned the Brick. PEZY moved to an advanced 3D packaging technology using ThruChip Interface (TCI) to interconnect the DRAM to the processor which uses wireless near-field inductive coupling instead of the traditional TSV.

References