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Difference between revisions of "renesas/r-car/m3"
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'''R-Car M3''' is a {{arch|64}} [[hepta-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The M3 incorporates four {{armh|Cortex-A53}} cores, two {{armh|Cortex-A57}}, and an additional {{armh|Cortex-R7}} core for real-time processing. This chip supports up to dual-channel LPDDR4-3200 memory.
 
'''R-Car M3''' is a {{arch|64}} [[hepta-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The M3 incorporates four {{armh|Cortex-A53}} cores, two {{armh|Cortex-A57}}, and an additional {{armh|Cortex-R7}} core for real-time processing. This chip supports up to dual-channel LPDDR4-3200 memory.
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== Cache ==
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{{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|arm holdings/microarchitectures/cortex-a57#Memory_Hierarchy|l1=Cortex-A53 § Cache|l2=Cortex-A57 § Cache}}
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{{cache size
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|l1 cache=544 KiB
 +
|l1i cache=256 KiB
 +
|l1i break=2x48+5x32 KiB
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|l1d cache=288 KiB
 +
|l1d break=9x32 KiB
 +
|l2 cache=1.5 MiB
 +
}}
 +
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== Memory controller ==
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{{memory controller
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|type=LPDDR4-3200
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|ecc=No
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|controllers=1
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|channels=2
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|width=32 bit
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|max bandwidth=11.92 GiB/s
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|bandwidth schan=5.96 GiB/s
 +
|bandwidth dchan=11.92 GiB/s
 +
}}

Revision as of 04:44, 23 July 2017

Template:mpu R-Car M3 is a 64-bit hepta-core ARM SoC designed by Renesas for the automotive industry and introduced in 2016. The M3 incorporates four Cortex-A53 cores, two Cortex-A57, and an additional Cortex-R7 core for real-time processing. This chip supports up to dual-channel LPDDR4-3200 memory.

Cache

Main articles: Cortex-A53 § Cache and Cortex-A57 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$544 KiB
557,056 B
0.531 MiB
L1I$256 KiB
262,144 B
0.25 MiB
2x48+5x32 KiB  
L1D$288 KiB
294,912 B
0.281 MiB
9x32 KiB  
L2$1.5 MiB
1,536 KiB
1,572,864 B
0.00146 GiB
     

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4-3200
Supports ECCNo
Controllers1
Channels2
Width32 bit
Max Bandwidth11.92 GiB/s
12,206.08 MiB/s
12.799 GB/s
12,799.003 MB/s
0.0116 TiB/s
0.0128 TB/s
Bandwidth
Single 5.96 GiB/s
Double 11.92 GiB/s
Retrieved from "https://en.wikichip.org/w/index.php?title=renesas/r-car/m3&oldid=56039"
Facts about "R-Car M3 - Renesas"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
R-Car M3 - Renesas#package +
core count7 +
core nameCortex-A53 +, Cortex-A57 + and Cortex-R7 +
core voltage0.9 V (9 dV, 90 cV, 900 mV) +
designerRenesas + and ARM Holdings +
familyR-Car +
first announcedOctober 19, 2016 +
first launchedOctober 2016 +
full page namerenesas/r-car/m3 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuPowerVR GX6250 +
integrated gpu designerImagination Technologies +
io voltage3.3 V (33 dV, 330 cV, 3,300 mV) +
isaARMv8 +
isa familyARM +
l1$ size480 KiB (491,520 B, 0.469 MiB) +
l1d$ size224 KiB (229,376 B, 0.219 MiB) +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ size1.5 MiB (1,536 KiB, 1,572,864 B, 0.00146 GiB) +
ldateOctober 2016 +
main imageFile:r-car m3.png +
manufacturerTSMC +
market segmentEmbedded +
max cpu count1 +
max memory bandwidth11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels2 +
microarchitectureCortex-A53 +, Cortex-A57 + and Cortex-R7 +
model numberM3 +
nameR-Car M3 +
packageFCBGA-1022 +
part numberR8A77960Frequency +
process16 nm (0.016 μm, 1.6e-5 mm) +
series3rd Gen +
smp max ways1 +
supported memory typeLPDDR4-3200 +
technologyCMOS +
thread count7 +
word size64 bit (8 octets, 16 nibbles) +