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Difference between revisions of "intel/xeon e3/e3-1275 v6"
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|core model=158
 
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'''Xeon E3-1275 v6''' is a {{arch|64}} [[quad-core]] [[x86]] workstation/entry server microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's [[14 nm process|14nm+ process]]. The E3-1275 v6 operates at 3.8 GHz with a TDP of 73 W supporting a {{intel|Turbo Boost}} frequency of 4.2 GHz. The processor supports up to 64 GiB of dual-channel DDR4-2400 ECC memory and incorporates Intel's {{intel|HD Graphics P630}} [[IGP]] operating at 350 MHz with a burst frequency of 1.15 GHz.
 
'''Xeon E3-1275 v6''' is a {{arch|64}} [[quad-core]] [[x86]] workstation/entry server microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's [[14 nm process|14nm+ process]]. The E3-1275 v6 operates at 3.8 GHz with a TDP of 73 W supporting a {{intel|Turbo Boost}} frequency of 4.2 GHz. The processor supports up to 64 GiB of dual-channel DDR4-2400 ECC memory and incorporates Intel's {{intel|HD Graphics P630}} [[IGP]] operating at 350 MHz with a burst frequency of 1.15 GHz.

Revision as of 23:53, 29 June 2017

Template:mpu Xeon E3-1275 v6 is a 64-bit quad-core x86 workstation/entry server microprocessor introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's 14nm+ process. The E3-1275 v6 operates at 3.8 GHz with a TDP of 73 W supporting a Turbo Boost frequency of 4.2 GHz. The processor supports up to 64 GiB of dual-channel DDR4-2400 ECC memory and incorporates Intel's HD Graphics P630 IGP operating at 350 MHz with a burst frequency of 1.15 GHz.

Cache

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
262,144 B
0.25 MiB
L1I$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associative 
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associativewrite-back
L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB4-way set associativewrite-back
L3$8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
  4x2 MiB16-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1866, DDR4-2400
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth35.76 GiB/s
36,618.24 MiB/s
38.397 GB/s
38,397.008 MB/s
0.0349 TiB/s
0.0384 TB/s
Bandwidth
Single 17.88 GiB/s
Double 35.76 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4


Graphics

[Edit/Modify IGP Info]

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Integrated Graphics Information
GPUHD Graphics P630
DesignerIntelDevice ID0x591D
Execution Units24Max Displays3
Max Memory1.7 GiB
1,740.8 MiB
1,782,579.2 KiB
1,825,361,100.8 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,150 MHz
1.15 GHz
1,150,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @30 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
TXTTrusted Execution Technology (SMX)
vProIntel vPro
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
TSXTransactional Synchronization Extensions
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
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Facts about "Xeon E3-1275 v6 - Intel"
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Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Xeon E3-1275 v6 - Intel#package + and Xeon E3-1275 v6 - Intel#io +
base frequency3,800 MHz (3.8 GHz, 3,800,000 kHz) +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point + and Union Point +
clock multiplier38 +
core count4 +
core family6 +
core model158 +
core nameKaby Lake DT +
core steppingB0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591D +
familyXeon E3 +
first announcedMarch 28, 2017 +
first launchedMarch 28, 2017 +
full page nameintel/xeon e3/e3-1275 v6 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Transactional Synchronization Extensions +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology + and OS Guard +
has intel enhanced speedstep technologytrue +
has intel secure key technologytrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics P630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,150 MHz (1.15 GHz, 1,150,000 KHz) +
integrated gpu max memory1,740.8 MiB (1,782,579.2 KiB, 1,825,361,100.8 B, 1.7 GiB) +
isax86-64 +
isa familyx86 +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description8-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description4-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description16-way set associative +
l3$ size8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldateMarch 28, 2017 +
manufacturerIntel +
market segmentWorkstation + and Server +
max cpu count1 +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberE3-1275 v6 +
nameXeon E3-1275 v6 +
packageFCLGA-1151 +
part numberCM8067702870931 + and BX80677E31275V6 +
platformGreenlow +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 339.00 (€ 305.10, £ 274.59, ¥ 35,028.87) +
s-specSR32A +
seriesE3-1200 v6 +
smp max ways1 +
socketLGA-1151 +
supported memory typeDDR3L-1866 + and DDR4-2400 +
tdp73 W (73,000 mW, 0.0979 hp, 0.073 kW) +
technologyCMOS +
thread count8 +
turbo frequency (1 core)4,200 MHz (4.2 GHz, 4,200,000 kHz) +
turbo frequency (2 cores)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (3 cores)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (4 cores)4,000 MHz (4 GHz, 4,000,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +