Semiconductor & Computer Engineering
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Difference between revisions of "intel/core i3/i3-7167u"
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'''Core i3-7167U''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 2.8 GHz with a TDP of 28 Watts, supports up to 32 GiB of dual-channel DDR4-2133. The i3-7167U incorporates Intel's {{intel|HD Graphics 650}} [[IGP]] operating at 300 MHz with burst frequency of 1 GHz. | '''Core i3-7167U''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 2.8 GHz with a TDP of 28 Watts, supports up to 32 GiB of dual-channel DDR4-2133. The i3-7167U incorporates Intel's {{intel|HD Graphics 650}} [[IGP]] operating at 300 MHz with burst frequency of 1 GHz. | ||
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| + | This specific model has a configurable TDP-down of 23 W. | ||
Revision as of 18:21, 4 January 2017
Template:mpu Core i3-7167U is a 64-bit dual-core low-end performance x86 mobile microprocessor introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's improved 14 nm+ process. This processor, which has a base frequency of 2.8 GHz with a TDP of 28 Watts, supports up to 32 GiB of dual-channel DDR4-2133. The i3-7167U incorporates Intel's HD Graphics 650 IGP operating at 300 MHz with burst frequency of 1 GHz.
This specific model has a configurable TDP-down of 23 W.