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* [[Alcatel]]
 
* [[Alcatel]]
 
* [[Alchip]]
 
* [[Alchip]]
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* [[All Winner Technology (Holding) Ltd]]
+
* [[Allwinner]] ''Technology (Holding) Ltd''
 
* [[Altera]]
 
* [[Altera]]
−
* [[Analog Devices Inc.]]
+
* [[Analog Devices]] ''Inc.''
 
* [[ARCA]]
 
* [[ARCA]]
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* [[Atheros Communications]]
+
* [[Atheros]] ''Communications''
−
* [[Atmel Corporation]]
+
* [[Atmel]] ''Corporation''
−
* [[Austriamicrosystems]]
+
* [[Austria Microsystems]]
−
* [[Avago Technologies]]
+
* [[Avago]] ''Technologies''
−
* [[Avalink Incorporated]]
+
* [[Avalink]] ''Incorporated''
−
* [[Beken Corporation]]
+
* [[Beken]] ''Corporation''
−
* [[Broadcom Corporation]]
+
* [[Broadcom]] ''Corporation''
−
* [[Cambridge Silicon Radio]]
+
* [[CSR]] (''Cambridge Silicon Radio'')
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* [[Capital Semiconductor Ltd]]
+
* [[Capital]] ''Semiconductor Ltd''
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* [[Chongqing Chongyou IT]]
+
* [[Chongqing]] ''Chongyou IT''
 
* [[Cirrus Logic]]
 
* [[Cirrus Logic]]
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* [[Conexant Systems Inc.]]
+
* [[Conexant]] ''Systems Inc.''
−
* [[Datang Microelectronics Technology]]
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* [[Datang Microelectronics]] ''Technology''
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* [[eSilicon Corporation]]
+
* [[eSilicon]] ''Corporation''
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* [[Faraday TechFocus Enhancements]]
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* [[Faraday]] ''TechFocus Enhancements''
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* [[Freescale Semiconductor]]
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* [[Freescale]] ''Semiconductor''
 
* [[Fujitsu]]
 
* [[Fujitsu]]
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* [[GCT Semiconductor]]
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* [[GCT]] ''Semiconductor''
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* [[Global Unichip Corporation]]
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* [[Global Unichip]] ''Corporation''
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* [[Huawei Technologies]]
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* [[Huawei Kirin|Huawei]] ''Technologies''
 
* [[ICP]]
 
* [[ICP]]
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* [[Infineon Technologies AG]]
+
* [[Infineon]] ''Technologies AG''
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* [[Ironkey Incorporated]]
+
* [[Ironkey]] ''Incorporated''
 
* [[Kawasaki Microelectronics]]
 
* [[Kawasaki Microelectronics]]
 
* [[Key ASIC]]
 
* [[Key ASIC]]
−
* [[Leadcore Technology Co Ltd]]
+
* [[Leadcore]] ''Technology Co Ltd''
 
* [[LSI Logic]]
 
* [[LSI Logic]]
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* [[Marvell Semiconductor]]
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* [[Marvell]] ''Semiconductor''
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* [[Mediatek Inc]]
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* [[MediaTek]] ''Inc''
 
* [[Micrel]]
 
* [[Micrel]]
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* [[Mindspeed Technologies Inc.]]
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* [[Mindspeed]] ''Technologies Inc''
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* [[Moschip Semiconductor]]
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* [[Moschip]] ''Semiconductor''
 
* [[Mtekvision]]
 
* [[Mtekvision]]
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* [[NationZ Technologies Inc]]
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* [[NationZ]] ''Technologies Inc''
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* [[NEC Electronics]]
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* [[NEC]] ''Electronics''
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* [[Neo Magic Corporation]]
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* [[Neo Magic]] ''Corporation''
 
* [[NXP]]
 
* [[NXP]]
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* [[Nuvoton Technology Corporation]]
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* [[Nuvoton]] ''Technology Corporation''
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* [[NVidia Corporation]]
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* [[Nvidia]] ''Corporation''
 
* [[OKI]]
 
* [[OKI]]
 
* [[Panasonic]]
 
* [[Panasonic]]
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* [[PulseLink]]
 
* [[PulseLink]]
 
* [[Qualcomm]]
 
* [[Qualcomm]]
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* [[Quanta Computer Inc]]
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* [[Quanta Computer]] ''Inc''
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* [[Renesas Technology]]
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* [[Renesas]] ''Technology''
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* [[RF Micro Devices]]
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* [[RFMD]] (''RF Micro Devices'')
 
* [[Rohm]]
 
* [[Rohm]]
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* [[Samsung Electronics]]
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* [[Samsung]] ''Electronics''
 
* [[Sandisk]]
 
* [[Sandisk]]
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* [[Sanyo Electric Co Ltd]]
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* [[Sanyo]] ''Electric Co Ltd''
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* [[Shanghai Jade Technologies]]
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* [[Shanghai Jade]] ''Technologies''
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* [[Sharp Corporation]]
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* [[Sharp]] ''Corporation''
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* [[Sierra Wireless SA]]
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* [[Sierra Wireless]] ''SA''
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* [[Skyworks Solutions Inc.]]
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* [[Skyworks]] ''Solutions Inc''
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* [[Socle Technology Corp]]
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* [[Socle]] ''Technology Corp''
 
* [[Sony]]
 
* [[Sony]]
 
* [[STMicroelectronics]]
 
* [[STMicroelectronics]]
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* [[Verisilicon]]
 
* [[Verisilicon]]
 
* [[Wisair]]
 
* [[Wisair]]
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* [[Zoran Corporation]]
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* [[Zoran]] ''Corporation''
 
</div>
 
</div>
  
 
== Die ==
 
== Die ==
−
=== ARM9TDMI ===
+
=== 0.35 μm ===
 +
==== ARM9TDMI ====
 
* [[0.35 μm process]]
 
* [[0.35 μm process]]
 
* 112,000 transistors
 
* 112,000 transistors
 
* 4.15 mm² die size
 
* 4.15 mm² die size
 
* 1.8 mW/MHz @ 3.0V
 
* 1.8 mW/MHz @ 3.0V
 +
* 120 MHz max frequency
  
−
=== ARM940T ===
+
==== ARM940T ====
 
* [[0.35 μm process]]
 
* [[0.35 μm process]]
 
* 800,000 transistors
 
* 800,000 transistors
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* 2 x 4 KiB caches
 
* 2 x 4 KiB caches
 
* 400 mW @  120 MHz core / 16 MHz bus
 
* 400 mW @  120 MHz core / 16 MHz bus
 +
 +
=== 0.25 μm ===
 +
==== ARM9TDMI ====
 +
* [[0.25 μm process]]
 +
* 3 metal layers
 +
* 110,000 transistors
 +
* 4.15 mm² die size
 +
* 2.5 V
 +
* 200 MHz max frequency
 +
* 150 mW
 +
 +
=== 0.18 μm ===
 +
==== ARM926EJ-S ====
 +
* [[0.18 μm process]]
 +
* 8.3 mm² die size (with cache)
 +
* 4.0 mm² die size (without cache)
 +
* 180-200 MHz max frequency
 +
* 1.40 mW/MHz with cache
 +
* 1.00 mW/MHz without cache
 +
 +
=== 0.13 μm ===
 +
==== ARM926EJ-S ====
 +
* [[0.13 μm process]]
 +
* 3.2 mm² die size (with cache)
 +
* 1.68 mm² die size (without cache)
 +
* 266 MHz max frequency
 +
* 0.45 mW/MHz with cache
 +
* 0.30 mW/MHz without cache
  
 
== Bibliography ==
 
== Bibliography ==
 
* October 16, 1997. Press Release {{\|pr1|"ARM announces new higher performance, low power ARM9 processor architecture"}}.
 
* October 16, 1997. Press Release {{\|pr1|"ARM announces new higher performance, low power ARM9 processor architecture"}}.
 
* Segars, Simon. "The ARM9 Family-High Performance Microprocessors for Embedded Applications." Proceedings of the International Conference on Computer Design. 1998.
 
* Segars, Simon. "The ARM9 Family-High Performance Microprocessors for Embedded Applications." Proceedings of the International Conference on Computer Design. 1998.

Latest revision as of 14:21, 11 October 2025

Edit Values
ARM9 µarch
General Info
Arch TypeCPU
DesignerARM Holdings
ManufacturerVLSI Technology, TSMC
IntroductionOctober 16, 1997
Succession

ARM9 is the successor to the ARM8, a low-power performance ARM microarchitecture designed by ARM Holdings for the mobile market. This microarchitecture is designed as an IP core and is sold to other semiconductor companies to be implemented in their own chips.

Architecture[edit]

Key changes from ARM8[edit]

New text document.svg This section is empty; you can help add the missing info by editing this page.

Block Diagram[edit]

New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory Hierarchy[edit]

New text document.svg This section is empty; you can help add the missing info by editing this page.

Licensees[edit]

In 2013 Arm reported 271 licensees. The following were named.

Die[edit]

0.35 μm[edit]

ARM9TDMI[edit]

  • 0.35 μm process
  • 112,000 transistors
  • 4.15 mm² die size
  • 1.8 mW/MHz @ 3.0V
  • 120 MHz max frequency

ARM940T[edit]

  • 0.35 μm process
  • 800,000 transistors
  • 13.0 mm² die size
  • 2 x 4 KiB caches
  • 400 mW @ 120 MHz core / 16 MHz bus

0.25 μm[edit]

ARM9TDMI[edit]

  • 0.25 μm process
  • 3 metal layers
  • 110,000 transistors
  • 4.15 mm² die size
  • 2.5 V
  • 200 MHz max frequency
  • 150 mW

0.18 μm[edit]

ARM926EJ-S[edit]

  • 0.18 μm process
  • 8.3 mm² die size (with cache)
  • 4.0 mm² die size (without cache)
  • 180-200 MHz max frequency
  • 1.40 mW/MHz with cache
  • 1.00 mW/MHz without cache

0.13 μm[edit]

ARM926EJ-S[edit]

  • 0.13 μm process
  • 3.2 mm² die size (with cache)
  • 1.68 mm² die size (without cache)
  • 266 MHz max frequency
  • 0.45 mW/MHz with cache
  • 0.30 mW/MHz without cache

Bibliography[edit]

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Facts about "ARM9 - Microarchitectures - ARM"
RDF feed
codenameARM9 +
designerARM Holdings +
first launchedOctober 16, 1997 +
full page namearm holdings/microarchitectures/arm9 +
instance ofmicroarchitecture +
manufacturerVLSI Technology + and TSMC +
microarchitecture typeCPU +
nameARM9 +