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− | {{qualcomm title|Snapdragon 845}}
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− | {{chip
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− | |future=Yes
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− | |chip type=accelerator
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− | |name=Samsung galaxy note 9
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− | |no image=No
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− | |image=0
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− | |family=Off
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− | |locked=No
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− | |mcp=No
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− | }}
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− | [[File:sdm845 block diagram.jpg|thumb|right|Block diagram]]
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− | '''Snapdragon 845''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2017]]. Fabricated on Samsung's [[10nm process|10nm 10LPP]], the 845 features four [[Kryo 385 Silver]] high-efficiency cores operating at 1.7 GHz along with four high-performance [[Kryo 385 Gold]] cores operating at 2.8 GHz. The Snapdragon 845 integrates the {{qualcomm|Adreno 630}} [[GPU]] operation at 710 MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.
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− | == Cache ==
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− | {{main|arm_holdings/microarchitectures/cortex-a75#Memory_Hierarchy|arm_holdings/microarchitectures/cortex-a55#Memory_Hierarchy|l1=Cortex-A75 § Cache|l2=Cortex-A55 § Cache}}
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− | Quad-core cluster {{armh|Cortex-A75|l=arch}}:
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− | {{cache size
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− | |l1 cache=512 KiB
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− | |l1i cache=256 KiB
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− | |l1i break=4x64 KiB
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− | |l1i desc=4-way set associative
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− | |l1d cache=256 KiB
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− | |l1d break=4x64 KiB
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− | |l1d desc=4-way set associative
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− | |l2 cache=1 MiB
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− | |l2 break=4x256 KiB
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− | |l2 desc=8-way set associative
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− | }}
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− |
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− | Quad-core cluster {{armh|Cortex-A55|l=arch}}:
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− | {{cache size
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− | |l1 cache=512 KiB
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− | |l1i cache=256 KiB
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− | |l1i break=4x64 KiB
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− | |l1i desc=2-way set associative
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− | |l1d cache=256 KiB
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− | |l1d break=4x64 KiB
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− | |l1d desc=4-way set associative
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− | |l2 cache=512 KiB
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− | |l2 break=4x128 KiB
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− | |l2 desc=8-way set associative
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− | }}
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− |
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− | * 2 MiB L3
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− |
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− | == Memory controller ==
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− | {{memory controller
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− | |type=LPDDR4X-3833
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− | |ecc=No
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− | |max mem=8 GiB
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− | |controllers=1
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− | |channels=4
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− | |width=16 bit
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− | |max bandwidth=29.87 GiB/s
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− | |frequency=1866 MHz
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− | |bandwidth schan=7.47 GiB/s
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− | |bandwidth dchan=14.93 GiB/s
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− | |bandwidth qchan=29.87 GiB/s
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− | }}
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− |
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− | == DSP ==
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− | {{#set: dsp|Hexagon 685 DSP}}
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− | This chip features [[Qualcomm]]'s {{qualcomm|Hexagon}} {{qualcomm|Hexagon 685|685}} DSP.
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− |
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− | == Graphics ==
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− | {{integrated graphics
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− | | gpu = Adreno 630 GPU
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− | | designer = Qualcomm
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− | | execution units = 2 (256x2 ALU)
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− | | max displays = 2
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− | | max memory =
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− | | frequency = 710 MHz
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− | | max frequency =
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− |
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− | | output crt =
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− | | output sdvo =
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− | | output dsi =
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− | | output edp =
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− | | output dp =
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− | | output hdmi =
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− | | output vga =
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− | | output dvi =
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− |
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− | | directx ver = 12
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− | | opengl ver =
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− | | opengl es ver = 3.2
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− | | opencl ver = 2.0
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− | | vulkan ver = 1.0
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− | | hdmi ver =
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− | | dp ver =
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− | | edp ver =
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− | | max res hdmi =
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− | | max res hdmi freq =
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− | | max res dp =
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− | | max res dp freq =
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− | | max res edp =
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− | | max res edp freq =
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− | | max res vga =
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− | | max res vga freq =
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− | }}
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− |
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− | * UHD video playback/encoding @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
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− | * Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps
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− | * H.264 (AVC), H.265 (HEVC), VP9, DisplayPort over USB Type-C support
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− |
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− | == Audio ==
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− | * Qualcomm Aqstic audio codec and speaker amplifier
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− | * Qualcomm aptX audio playback with support for aptX Classic and HD
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− | * Native DSD support, PCM up to 384kHz/32bit
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− |
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− | == Camera ==
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− | * Image Signal Processor
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− | ** Qualcomm Spectra 280
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− | ** New architecture for 14-bit image signal processing, with support for up to:
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− | *** Single HFR 16 MPix camera at 60fps ZSL
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− | *** Dual 16 MPix cameras at 30fps ZSL
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− | *** Single 32 MPix camera at 30fps ZSL
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− | ** Can connect up to 7 different cameras (many configurations possible)
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− | *** Multi-frame Noise Reduction (MFNR) with accelerated image stabilization
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− | *** Hybrid Autofocus with support for dual phase detection (2PD) sensors
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− | *** Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
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− | *** Higher quality video capture with Motion Compensated Temporal Filtering (MCTF)
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− | *** 3D structured light active depth sensing, with accelerated face detection/recognition
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− |
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− | == Connectivity ==
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− | * X20 LTE Modem
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− | ** Downlink:
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− | *** LTE Cat 18 up to 1.2 Gbps, 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers
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− | ** Uplink:
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− | *** LTE Cat 13 up to 150 Mbps, Upload+ (2x20 MHz carrier aggregation, up to 64-QAM)
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− | ** License Assisted Access (LAA)
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− | ** Citizens Broadband Radio Service (CBRS) shared radio spectrum
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− | ** Dual SIM Dual VoLTE (DSDV)
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− | ** All Mode with support for all major cellular modes plus LAA.
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− | *** VoLTE with SRVCC to 3G and 2G, HD and Ultra HD Voice (EVS), CSFB to 3G and 2G
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− | *** Voice over Wi-Fi (VoWiFi) with LTE call continuity
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− |
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− | * Wi-Fi
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− | ** 802.11ad Multi-gigabit with 60 GHz diversity module
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− | ** 802.11ac 2x2 with MU-MIMO
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− | ** Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual-Band Simultaneous (DBS) + 60 GHz
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− | ** 11k/r/v: Enhanced mobility, fast acquisition and congestion mitigation for Carrier Wi-Fi
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− |
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− | * Bluetooth
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− | ** Bluetooth 5.0
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− | *** Proprietary enhancements
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− | **** Ultra-low power wireless earbuds
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− | **** Direct audio broadcast to multiple devices
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− | == Location ==
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− | * Systems: GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
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− | * Low Power Geofencing and Tracking, Sensor-assisted Navigation
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− | == Utilizing devices ==
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− |
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− | * [[used by::Asus Zenfone 5Z]]
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− | * [[used by::Comma Three]]
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− | * [[used by::Google Pixel 3]]
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− | * [[used by::Google Pixel 3 XL]]
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− | * [[used by::HTC U12+]]
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− | * [[used by::LG G7 ThinQ]]
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− | * [[used by::LG V35 ThinQ]]
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− | * [[used by::LG V40 ThinQ]]
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− | * [[used by::Nokia 9 PureView]]
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− | * [[used by::OnePlus 6]]
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− | * [[used by::OnePlus 6T]]
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− | * [[used by::Oppo Find X]]
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− | * [[used by::Razer Phone 2]]
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− | * [[used by::Samsung Galaxy Note9]]
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− | * [[used by::Samsung Galaxy S9]]
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− | * [[used by::Samsung Galaxy S9+]]
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− | * [[used by::Shift 6mq]]
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− | * [[used by::Sony Xperia XZ2]]
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− | * [[used by::Sony Xperia XZ2 compact]]
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− | * [[used by::Sony Xperia XZ2 Premium]]
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− | * [[used by::Sony Xperia XZ3]]
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− | * [[used by::Xiaomi Mi Mix 3]]
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− | * [[used by::Xiaomi Mi Mix 2s]]
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− | * [[used by::Xiaomi Mi 8]]
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− | * [[used by::Xiaomi Pocophone F1]]
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− | * [[used by::ZTE Axon 9 Pro]]
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− | {{expand list}}
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− |
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− | == Die ==
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− | * Samsung [[10LPP|10nm 10LPP]]
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− | * 95 mm²
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− | :''Die photo by [https://www.techinsights.com/blog/apple-iphone-11-pro-max-teardown TechInsights]''
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− | :[[File:845 die shot.png|500px]]
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− | == Documents ==
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− | * [[:File:sdm845pb.pdf|SDM845 Product Brief]]
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− | * [[:File:snapdragon-845-connectivity-pillar-presentation-by-peter-carson.pdf|SDM 845 connectivity presentation]]
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− | * [[:File:snapdragon-845-performance-pillar-presentation-by-travis-lanier.pdf|Architecture deep dive]]
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− | * [[:File:snapdragon-845-security-pillar-presentation-by-sy-choudhury.pdf|Mobile security experiences with Snapdragon 845]]
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