Information for "hisilicon/kunpeng"

Basic information

Display title	Kunpeng (Hi16xx) - HiSilicon
Default sort key	Kunpeng (Hi16xx), HiSilicon
Page length (in bytes)	5,206
Page ID	30841
Page content language	English (en)
Page content model	wikitext
Indexing by robots	Allowed
Number of redirects to this page	8
Counted as a content page	Yes
Number of subpages of this page	7 (1 redirect; 6 non-redirects)

Edit	Allow all users (infinite)
Move	Allow all users (infinite)

Page creator	David (talk \| contribs)
Date of page creation	23:05, 21 July 2018
Latest editor	95.24.54.37 (talk)
Date of latest edit	13:49, 27 March 2025
Total number of edits	19
Total number of distinct authors	2
Recent number of edits (within past 90 days)	0
Recent number of distinct authors	0

Transcluded templates (23)	Templates used on this page: Template:!- (edit) Template:arch (view source) (protected) Template:arm (edit) Template:cavium (edit) Template:comma2 (edit) Template:comp table count (edit) Template:comp table end (edit) Template:comp table header (edit) Template:comp table start (edit) Template:hisilicon (edit) Template:hisilicon title (edit) Template:ic family (edit) Template:intel (view source) (protected) Template:link-arm (edit) Template:link-cavium (edit) Template:link-intel (view source) (protected) Template:link-qualcomm (edit) Template:proc table 3 (view source) (protected) Template:qualcomm (edit) Template:see also (edit) Template:url parse anchor (view source) (protected) Template:url parse article (view source) (protected) Module:comptable (view source)

designer	HiSilicon + and ARM Holdings +
first announced	2014 +
full page name	hisilicon/kunpeng +
instance of	system on a chip family +
instruction set architecture	ARM +
main designer	HiSilicon +
manufacturer	TSMC +
name	Kunpeng +
technology	CMOS +
word size	64 bit (8 octets, 16 nibbles) +