From WikiChip
Information for "hisilicon/k3/k3v2e"

Basic information

Display titleK3V2E - HiSilicon
Default sort keyK3V2E, HiSilicon
Page length (in bytes)2,512
Page ID25481
Page content languageEnglish (en)
Page content modelwikitext
Indexing by robotsAllowed
Number of redirects to this page2
Counted as a content pageYes
Number of subpages of this page0 (0 redirects; 0 non-redirects)

Page protection

EditAllow all users (infinite)
MoveAllow all users (infinite)

Edit history

Page creatorInject (talk | contribs)
Date of page creation12:36, 6 September 2017
Latest editorChippyBot (talk | contribs)
Date of latest edit16:13, 13 December 2017
Total number of edits4
Total number of distinct authors2
Recent number of edits (within past 90 days)0
Recent number of distinct authors0

Page properties

Transcluded templates (21)

Templates used on this page:

Facts about "K3V2E - HiSilicon"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
K3V2E - HiSilicon#package +
base frequency1,500 MHz (1.5 GHz, 1,500,000 kHz) +
core count4 +
core nameCortex-A9 +
designerHiSilicon + and ARM Holdings +
familyK3 +
first announced2013 +
first launched2013 +
full page namehisilicon/k3/k3v2e +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuGC4000 +
integrated gpu base frequency480 MHz (0.48 GHz, 480,000 KHz) +
integrated gpu designerVivante +
integrated gpu execution units16 +
isaARMv7 +
isa familyARM +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ description4-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description4-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description8-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
ldate2013 +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory bandwidth6.71 GiB/s (6,871.04 MiB/s, 7.205 GB/s, 7,204.808 MB/s, 0.00655 TiB/s, 0.0072 TB/s) +
max memory channels2 +
microarchitectureCortex-A9 +
model numberK3V2E +
nameK3V2E +
packageTFBGA-576 +
part numberHi3620 +
process40 nm (0.04 μm, 4.0e-5 mm) +
smp max ways1 +
supported memory typeLPDDR2-900 +
technologyCMOS +
thread count4 +
transistor count600,000,000 +
used byHuawei HN3-U01 +, Huawei Ascend P6 +, Ascend W2 + and Huawei Honor 3 +
word size32 bit (4 octets, 8 nibbles) +