Semiconductor & Computer Engineering
-
WikiChip
WikiChip
-
Architectures
Popular x86
-
Intel
- Client
- Server
- Big Cores
- Small Cores
-
AMD
Popular ARM
-
ARM
- Server
- Big
- Little
-
Cavium
-
Samsung
-
-
Chips
Popular Families
-
Ampere
-
Apple
-
Cavium
-
HiSilicon
-
MediaTek
-
NXP
-
Qualcomm
-
Renesas
-
Samsung
-
From WikiChip
Revision history of "amd/packages/fp3"
Diff selection: Mark the radio boxes of the revisions to compare and hit enter or the button at the bottom.
Legend: (cur) = difference with latest revision, (prev) = difference with preceding revision, m = minor edit.
Retrieved from "https://en.wikichip.org/wiki/amd/packages/fp3"
Facts about "Package FP3 - AMD"
| designer | AMD + |
| first launched | June 2014 + |
| instance of | package + |
| market segment | Mobile + and Embedded + |
| microarchitecture | Steamroller + |
| name | Package FP3 + |
| package | BGA-854 + and FP3 + |
| package contacts | 854 + |
| package length | 29 mm (2.9 cm, 1.142 in) + |
| package pitch | 0.8 mm (0.0315 in) + |
| package type | Organic Micro Ball Grid Array + |
| package width | 32 mm (3.2 cm, 1.26 in) + |
| tdp | 35 W (35,000 mW, 0.0469 hp, 0.035 kW) + |