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  • (cur | prev) 07:49, 17 March 2022‎ QuietRub (talk | contribs)‎ . . (4,439 bytes) (+4,439)‎ . . (Created page with "{{title|Alchemy Au1100-333MBF}} {{chip |name=Alchemy Au1100-333MBF |no image=Yes |designer=Alchemy |model number=Au1100-333MBF |part number=Au1100-333MBFBA |part number 2=Au11...")
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Facts about "Alchemy Au1100-333MBF"
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base frequency333 MHz (0.333 GHz, 333,000 kHz) +
core count1 +
core steppingBA +, BC +, BD +, BE + and BF +
core voltage1.22 V (12.2 dV, 122 cV, 1,220 mV) +
designerAlchemy +
familyAlchemy +
first launchedApril 8, 2002 +
full page namealchemy/au1100-333mbf +
has ecc memory supportfalse +
has featureindustrial temperature range +
instance ofmicroprocessor +
io voltage3.3 V (33 dV, 330 cV, 3,300 mV) +
isaMIPS32 +
l1$ size32 KiB (32,768 B, 0.0313 MiB) +
l1d$ description4-way set associative +
l1d$ size16 KiB (16,384 B, 0.0156 MiB) +
l1i$ description4-way set associative +
l1i$ size16 KiB (16,384 B, 0.0156 MiB) +
ldateApril 8, 2002 +
manufacturerTSMC +
market segmentEmbedded +
max case temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max cpu count1 +
max memory192 MiB (196,608 KiB, 201,326,592 B, 0.188 GiB, 1.831055e-4 TiB) +
max memory bandwidth0.31 GiB/s (317.574 MiB/s, 0.333 GB/s, 333 MB/s, 3.028617e-4 TiB/s, 3.33e-4 TB/s) +
max memory channels1 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureAu1 +
min case temperature233.15 K (-40 °C, -40 °F, 419.67 °R) +
min storage temperature233.15 K (-40 °C, -40 °F, 419.67 °R) +
model numberAu1100-333MBF +
nameAlchemy Au1100-333MBF +
part numberAu1100-333MBFBA +, Au1100-333MBFBC +, Au1100-333MBFBD +, Au1100-333MBFBE + and Au1100-333MBFBF +
process130 nm (0.13 μm, 1.3e-4 mm) +
smp max ways1 +
supported memory typeSDR-133 +
tdp (typical)0.2 W (200 mW, 2.682e-4 hp, 2.0e-4 kW) +
technologyCMOS +
word size32 bit (4 octets, 8 nibbles) +