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  • (cur | prev) 23:41, 15 March 2022‎ QuietRub (talk | contribs)‎ . . (4,197 bytes) (+4,197)‎ . . (Created page with "{{title|Alchemy Au1000-266MCC}} {{chip |name=Alchemy Au1000-266MCC |no image=Yes |designer=Alchemy |model number=Au1000-266MCC |part number=Au1000-266MCC |prid=0x30100 |prid 2...")
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Facts about "Alchemy Au1000-266MCC"
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base frequency266 MHz (0.266 GHz, 266,000 kHz) +
core count1 +
core steppingDA +, HA +, HB +, HC + and HD +
core voltage1.5 V (15 dV, 150 cV, 1,500 mV) +
core voltage tolerance5% +
designerAlchemy +
familyAlchemy +
first announcedJune 13, 2000 +
first launchedFebruary 2001 +
full page namealchemy/au1000-266mcc +
has ecc memory supportfalse +
instance ofmicroprocessor +
io voltage3.3 V (33 dV, 330 cV, 3,300 mV) +
isaMIPS32 +
l1$ size32 KiB (32,768 B, 0.0313 MiB) +
l1d$ description4-way set associative +
l1d$ size16 KiB (16,384 B, 0.0156 MiB) +
l1i$ description4-way set associative +
l1i$ size16 KiB (16,384 B, 0.0156 MiB) +
ldateFebruary 2001 +
manufacturerTSMC +
market segmentEmbedded +
max case temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max cpu count1 +
max memory192 MiB (196,608 KiB, 201,326,592 B, 0.188 GiB, 1.831055e-4 TiB) +
max memory bandwidth0.248 GiB/s (253.677 MiB/s, 0.266 GB/s, 266 MB/s, 2.419256e-4 TiB/s, 2.66e-4 TB/s) +
max memory channels1 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureAu1 +
min case temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature233.15 K (-40 °C, -40 °F, 419.67 °R) +
model numberAu1000-266MCC +
nameAlchemy Au1000-266MCC +
part numberAu1000-266MCC +
process180 nm (0.18 μm, 1.8e-4 mm) +
smp max ways1 +
supported memory typeSDR-133 +
tdp (typical)0.3 W (300 mW, 4.023e-4 hp, 3.0e-4 kW) +
technologyCMOS +
word size32 bit (4 octets, 8 nibbles) +