Editing renesas/r-car/m3 (sip)

{{renesas title|R-Car M3 (SiP)}}
{{chip
|name=R-Car M3 (SiP)
|image=r-car m3 (sip).png
|image size=125px
|designer=Renesas
|designer 2=ARM Holdings
|manufacturer=TSMC
|model number=M3 (SiP)
|part number=R8J77960
|market=Embedded
|first announced=October 19, 2016
|first launched=October, 2016
|family=R-Car
|series=3rd Gen
|isa=ARMv8
|isa family=ARM
|microarch=Cortex-A53
|microarch 2=Cortex-A57
|microarch 3=Cortex-R7
|core name=Cortex-A53
|core name 2=Cortex-A57
|core name 3=Cortex-R7
|process=16 nm
|technology=CMOS
|word size=64 bit
|core count=7
|thread count=7
|max cpus=1
|v core=0.9 V
|v io=3.3 V
|package module 1={{packages/renesas/fcbga-1255}}
}}
'''R-Car M3''' is a {{arch|64}} [[hepta-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The M3 incorporates four {{armh|Cortex-A53}} cores, two {{armh|Cortex-A57}}, and an additional {{armh|Cortex-R7}} core for real-time processing. This chip supports up to dual-channel LPDDR4-3200 memory.  This chip incorporates the [[imagination technologies|Imagination]]'s {{imgtec|PowerVR GX6250}} [[GPU]].

This model is an [[SiP]] variant of the {{\\|M3}} which include the DDR memory on-package.

== Cache ==
{{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|arm holdings/microarchitectures/cortex-a57#Memory_Hierarchy|l1=Cortex-A53 § Cache|l2=Cortex-A57 § Cache}}
{{cache size
|l1 cache=480 KiB
|l1i cache=256 KiB
|l1i break=2x48+5x32 KiB
|l1d cache=224 KiB
|l1d break=7x32 KiB
|l2 cache=1.5 MiB
}}

== Memory controller ==
{{memory controller
|type=LPDDR4-3200
|ecc=No
|controllers=1
|channels=2
|width=32 bit
|max bandwidth=11.92 GiB/s
|bandwidth schan=5.96 GiB/s
|bandwidth dchan=11.92 GiB/s
}}

== Expansions ==
* USB 3.0 host interface (DRD) × 1 port (wPHY)
* USB 2.0 host interface × 1 port (wPHY)
* USB 2.0 host/function/OTG interface × 1 port (wPHY)
* SD host interface × 4 ch (SDR104)
* Multimedia card interface × 2 ch
* PCI Express 2.0 (1 lane) x 2 ch
* Media local bus (MLB) interface × 1 ch (3-pin interface)
* Controller area network (CAN-FD support) interface × 2ch
* Ethernet AVB 1.0-compatible MAC built in Interface: RGMII / Ethernet AVB (802.1BA)
* I2C bus interface × 8 ch
* Serial communication interface (SCIF) × 11 ch
* SPI multi I/O bus controller (RPC) × 1 ch (HyperFlashTM/QSPI support)
* Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
* Digital radio interface (DRIF) × 4 ch

== Graphics ==
{{integrated graphics
| gpu                 = PowerVR GX6250
| designer            = Imagination Technologies
}}

== Features == 
{{arm features
|thumb=No
|thumb2=No
|thumbee=No
|vfpv1=No
|vfpv2=No
|vfpv3=No
|vfpv3-d16=No
|vfpv3-f16=No
|vfpv4=Yes
|vfpv4-d16=No
|vfpv5=No
|neon=Yes
|trustzone=Yes
|jazelle=No
|wmmx=No
|wmmx2=No
}}

== Block Diagram ==
:: [[File:blk rcar m3.jpg|750px]]
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	R-Car M3 (SiP) - Renesas#package +
core count	7 +
core name	Cortex-A53 +, Cortex-A57 + and Cortex-R7 +
core voltage	0.9 V (9 dV, 90 cV, 900 mV) +
designer	ARM Holdings + and Renesas +
family	R-Car +
first announced	October 19, 2016 +
first launched	October 2016 +
full page name	renesas/r-car/m3 (sip) +
has ecc memory support	false +
instance of	microprocessor +
integrated gpu	PowerVR GX6250 +
integrated gpu designer	Imagination Technologies +
io voltage	3.3 V (33 dV, 330 cV, 3,300 mV) +
isa	ARMv8 +
isa family	ARM +
l1$ size	480 KiB (491,520 B, 0.469 MiB) +
l1d$ size	224 KiB (229,376 B, 0.219 MiB) +
l1i$ size	256 KiB (262,144 B, 0.25 MiB) +
l2$ size	1.5 MiB (1,536 KiB, 1,572,864 B, 0.00146 GiB) +
ldate	October 2016 +
main image	+
manufacturer	TSMC +
market segment	Embedded +
max cpu count	1 +
max memory bandwidth	11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels	2 +
microarchitecture	Cortex-A53 +, Cortex-A57 + and Cortex-R7 +
model number	M3 (SiP) +
name	R-Car M3 (SiP) +
package	FCBGA-1255 +
part number	R8J77960 +
process	16 nm (0.016 μm, 1.6e-5 mm) +
series	3rd Gen +
smp max ways	1 +
supported memory type	LPDDR4-3200 +
technology	CMOS +
thread count	7 +
word size	64 bit (8 octets, 16 nibbles) +