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{{qualcomm title|Snapdragon 855}}
 
{{qualcomm title|Snapdragon 855}}
 
{{chip
 
{{chip
|name=Qualcomm Snapdragon 855
+
|name=Snapdragon 855+
 
|image=sd 855 (front).png
 
|image=sd 855 (front).png
 
|back image=sd 855 (back).png
 
|back image=sd 855 (back).png
Line 11: Line 11:
 
|market=Mobile
 
|market=Mobile
 
|first announced=December 4, 2018
 
|first announced=December 4, 2018
|first launched=March, 2019
+
|first launched=Q1, 2019
 
|family=Snapdragon 800
 
|family=Snapdragon 800
 
|series=800
 
|series=800
Line 24: Line 24:
 
|core name 2=Kryo 485 Silver
 
|core name 2=Kryo 485 Silver
 
|process=7 nm
 
|process=7 nm
|transistors=6,700,000,000
 
 
|technology=CMOS
 
|technology=CMOS
 
|die area=73.27 mm²
 
|die area=73.27 mm²
Line 32: Line 31:
 
|core count=8
 
|core count=8
 
|thread count=8
 
|thread count=8
 +
|max cpus=1
 
|max memory=16 GiB
 
|max memory=16 GiB
|max cpus=1
 
 
|predecessor=Snapdragon 845
 
|predecessor=Snapdragon 845
 
|predecessor link=qualcomm/snapdragon 800/845
 
|predecessor link=qualcomm/snapdragon 800/845
|successor=Snapdragon 865
+
|contemporary=Snapdragon 855+
|successor link=qualcomm/snapdragon_800/865
 
|contemporary=Snapdragon 855+/860
 
 
|contemporary link=qualcomm/snapdragon_800/855 plus
 
|contemporary link=qualcomm/snapdragon_800/855 plus
 
}}
 
}}
 
[[File:snapdragon-855-block-diagram.png|thumb|right|Block Diagram|200px]]
 
[[File:snapdragon-855-block-diagram.png|thumb|right|Block Diagram|200px]]
'''Snapdragon 855''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2018]]. Fabricated on [[N7|TSMC 7nm process]], the 855 features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at 585 MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.
+
'''Snapdragon 855''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2018]]. Fabricated on TSMC's [[7nm process]], the 855 features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at 600 MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.
  
 
The Snapdragon 855 can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.
 
The Snapdragon 855 can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.
  
The {{\\|855 Plus}} is an identical, but higher clocked version of this processor.
+
The {{\\|855 Plus}} is an identical, but a higher clocked version of this processor.
 
 
== Clock domains ==
 
{{see also|7 nm lithography process#N7|l1=TSMC 7-nanometer (N7) process technology}}
 
The Snapdragon 855 utilizes TSMC [[N7|7-nanometer]] process. One of the major changes Qualcomm has done compared to the [[Snapdragon 845]] is on the physical implementation side. Whereas the Snapdragon 845 uses two clock domains in a standard [[DynamIQ]] cluster - one for the Silver cores and one for the Gold cores, the 855 uses three clock domains. One of the cores from the prior quad-core Gold clock domains has been moved to its own clock domain. Qualcomm refers to that core as a 'Prime' core. The Prime core utilizes TSMC high-performance cell (which uses a slightly relaxed 64 nm poly pitch) while the rest of the SoC utilizes TSMC standard high-density cells. The use of the high-performance [[standard cell|cells]] allows for the slightly higher frequency at similar power.
 
 
 
 
 
[[File:sdm855-clocks.svg|500px]]
 
 
 
 
 
Qualcomm reported that at the same power, Clock2 CPUs have improved by roughly 20% from the SDM845 to the SDM855. With the addition of Clock3, the four cores collectively extend this performance gain over the quad-core cluster on the 845 to over 30%. Check New [https://www.dopetechnews.com/Comparison/qualcomm-snapdragon-8-gen-1-vs-a15-bionic/ Qualcomm Snapdragon 8 gen 1 vs A15 Bionic] Comparison
 
 
 
 
 
[[File:855 clock improvement.png|550px]]
 
  
 
== Cache ==
 
== Cache ==
 
{{main|arm_holdings/microarchitectures/cortex-a76#Memory_Hierarchy|arm_holdings/microarchitectures/cortex-a55#Memory_Hierarchy|l1=Cortex-A76 § Cache|l2=Cortex-A55 § Cache}}
 
{{main|arm_holdings/microarchitectures/cortex-a76#Memory_Hierarchy|arm_holdings/microarchitectures/cortex-a55#Memory_Hierarchy|l1=Cortex-A76 § Cache|l2=Cortex-A55 § Cache}}
  
Prime core {{armh|Cortex-A76|l=arch}}:
+
1+3 core cluster {{armh|Cortex-A76|l=arch}}:
 
{{cache size
 
{{cache size
|l1 cache=128 KiB
+
|l1 cache=512 KiB
|l1i cache=64 KiB
+
|l1i cache=256 KiB
|l1i break=1x64 KiB
+
|l1i break=4x64 KiB
 
|l1i desc=4-way set associative
 
|l1i desc=4-way set associative
|l1d cache=64 KiB
+
|l1d cache=256 KiB
|l1d break=1x64 KiB
+
|l1d break=4x64 KiB
|l1d desc=4-way set associative
 
|l2 cache=512 KiB
 
|l2 break=1x512 KiB
 
|l2 desc=8-way set associative
 
}}
 
 
 
3 core cluster {{armh|Cortex-A76|l=arch}}:
 
{{cache size
 
|l1 cache=384 KiB
 
|l1i cache=192 KiB
 
|l1i break=3x64 KiB
 
|l1i desc=4-way set associative
 
|l1d cache=192 KiB
 
|l1d break=3x64 KiB
 
 
|l1d desc=4-way set associative
 
|l1d desc=4-way set associative
|l2 cache=768 KiB
+
|l2 cache=1 MiB
|l2 break=3x256 KiB
+
|l2 break=4x256 KiB
 
|l2 desc=8-way set associative
 
|l2 desc=8-way set associative
 
}}
 
}}
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|max mem=16 GiB
 
|max mem=16 GiB
 
|controllers=1
 
|controllers=1
|channels=4
+
|channels=8
 
|width=16 bit
 
|width=16 bit
 
|max bandwidth=31.79 GiB/s
 
|max bandwidth=31.79 GiB/s
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== DSP ==
 
== DSP ==
 
{{#set: dsp|Hexagon 690 DSP}}
 
{{#set: dsp|Hexagon 690 DSP}}
This chip features [[Qualcomm]]'s {{qualcomm|Hexagon}} {{qualcomm|Hexagon 690|690}} DSP.
+
This chip features [[Qualcomm]]'s {{qualcomm|Hexagon}} {{qualcomm|Hexagon 685|685}} DSP.
  
 
== Graphics ==
 
== Graphics ==
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| gpu                = Adreno 640 GPU
 
| gpu                = Adreno 640 GPU
 
| designer            = Qualcomm
 
| designer            = Qualcomm
| execution units    = 2 (384x2 ALU)
+
| execution units    =  
 
| max displays        = 2
 
| max displays        = 2
 
| max memory          =  
 
| max memory          =  
| frequency          = 257 MHz
+
| frequency          = 250 MHz
| max frequency      = 585 MHz
+
| max frequency      = 600 MHz
  
 
| output crt          =  
 
| output crt          =  
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* WiFi
 
* WiFi
 
** Standards: 802.11ax, 802.11ac Wave 2, 802.11a/b/g, 802.11n
 
** Standards: 802.11ax, 802.11ac Wave 2, 802.11a/b/g, 802.11n
** Spectral Bands: 2.4 GHz, 5 GHz
+
** Spectral Bands: 2.4 GHz, 5 GHz, 6 GHz
  
 
* Bluetooth
 
* Bluetooth
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== Utilizing devices ==
 
== Utilizing devices ==
* [[used by::Asus ROG Phone 2]]
+
* [[used by::Asus RoG Phone 2]]
* [[used by::Asus Zenfone 6]]
 
 
* [[used by::Asus Zenfone 6Z]]
 
* [[used by::Asus Zenfone 6Z]]
 
* [[used by::Blackshark 2 SKywalker]]
 
* [[used by::Blackshark 2 SKywalker]]
* [[used by::Google Pixel 4/XL]]
+
* [[used by::Galaxy Note 10]]
* [[used by::Lenovo Z5 Pro GT]]
 
* [[used by::Lenovo Z6 Pro]]
 
 
* [[used by::LG G8 ThinQ]]
 
* [[used by::LG G8 ThinQ]]
* [[used by::LG G8S ThinQ]]
 
* [[used by::LG G8X ThinQ]]
 
 
* [[used by::LG V50 ThinQ]]
 
* [[used by::LG V50 ThinQ]]
* [[used by::LG V50S ThinQ]]
+
* [[used by::OnePlus 7]]
* [[used by::Meizu 16s]]
 
* [[used by::Microsoft Surface Duo]]
 
 
* [[used by::OnePlus 7 Pro]]
 
* [[used by::OnePlus 7 Pro]]
* [[used by::OnePlus 7]]
+
* [[used by::OPPO Reno]]
* [[used by::OnePlus 7T Pro]]
+
* [[used by::Samsung Galaxy Tab S6]]
* [[used by::OnePlus 7T]]
+
* [[used by::Samsung Galaxy S10+]]
* [[used by::OPPO Reno 10x Zoom]]
 
* [[used by::Oppo Reno 10x Zoom]]
 
* [[used by::Realme X2 PRO]]
 
* [[used by::Samsung Galaxy A90 5G]]
 
* [[used by::Samsung Galaxy Fold]]
 
* [[used by::Samsung Galaxy Note 10]]
 
* [[used by::Samsung Galaxy Note 10+]]
 
* [[used by::Samsung Galaxy S10 5G]]
 
* [[used by::Samsung Galaxy S10 Lite]]
 
 
* [[used by::Samsung Galaxy S10]]
 
* [[used by::Samsung Galaxy S10]]
* [[used by::Samsung Galaxy S10+]]
 
 
* [[used by::Samsung Galaxy S10e]]
 
* [[used by::Samsung Galaxy S10e]]
* [[used by::Samsung Galaxy Tab S6]]
 
* [[used by::Sharp Aquos R3]]
 
 
* [[used by::Sony Xperia 1]]
 
* [[used by::Sony Xperia 1]]
 
* [[used by::Sony Xperia 5]]
 
* [[used by::Sony Xperia 5]]
* [[used by::VIVO IQOO]]
 
 
* [[used by::Xiaomi Mi 9]]
 
* [[used by::Xiaomi Mi 9]]
 
* [[used by::Xiaomi Mi 9T Pro]]
 
* [[used by::Xiaomi Mi 9T Pro]]
 +
* [[used by::Redmi K20 Pro]]
 
* [[used by::Xiaomi Mi MIX 3 5G Edition]]
 
* [[used by::Xiaomi Mi MIX 3 5G Edition]]
* [[used by::Xiaomi Poco X3 Pro]]
 
 
* [[used by::Xiaomi Redmi K20 Pro]]
 
* [[used by::Xiaomi Redmi K20 Pro]]
 
* [[used by::ZTE Axon 10 Pro]]
 
* [[used by::ZTE Axon 10 Pro]]
 
* [[used by::ZTE Nubia Red Magic 3]]
 
* [[used by::ZTE Nubia Red Magic 3]]
 +
* [[used by::Google Pixel 4]]
 +
* [[used by:: Lenovo Z6 Pro]]
 +
 
{{expand list}}
 
{{expand list}}
  
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== Bibliography ==
 
== Bibliography ==
* {{bib|vlsi|2019|Qualcomm, TSMC}}
 
 
* Techinsights ''[https://www.techinsights.com/about-techinsights/overview/blog/Lenovo-Brings-the-New-Snapdragon-to-Market/ "Lenovo Brings the New Snapdragon to Market"]''
 
* Techinsights ''[https://www.techinsights.com/about-techinsights/overview/blog/Lenovo-Brings-the-New-Snapdragon-to-Market/ "Lenovo Brings the New Snapdragon to Market"]''
 
* WikiChip Fuse ''[https://fuse.wikichip.org/news/2408/tsmc-7nm-hd-and-hp-cells-2nd-gen-7nm-and-the-snapdragon-855-dtco/ "TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO"]''
 
* WikiChip Fuse ''[https://fuse.wikichip.org/news/2408/tsmc-7nm-hd-and-hp-cells-2nd-gen-7nm-and-the-snapdragon-855-dtco/ "TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO"]''

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back imageFile:sd 855 (back).png +
base frequency1,800 MHz (1.8 GHz, 1,800,000 kHz) +, 2,420 MHz (2.42 GHz, 2,420,000 kHz) + and 2,840 MHz (2.84 GHz, 2,840,000 kHz) +
core count8 +
core nameKryo 485 Gold + and Kryo 485 Silver +
designerARM Holdings + and Qualcomm +
die area73.27 mm² (0.114 in², 0.733 cm², 73,270,000 µm²) +
die length8.48 mm (0.848 cm, 0.334 in, 8,480 µm) +
die width8.64 mm (0.864 cm, 0.34 in, 8,640 µm) +
dspHexagon 690 DSP +
familySnapdragon 800 +
first announcedDecember 4, 2018 +
first launchedMarch 2019 +
full page namequalcomm/snapdragon 800/855 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 640 GPU +
integrated gpu base frequency257 MHz (0.257 GHz, 257,000 KHz) +
integrated gpu designerQualcomm +
integrated gpu max frequency585 MHz (0.585 GHz, 585,000 KHz) +
isaARMv8 +
isa familyARM +
l1$ size128 KiB (131,072 B, 0.125 MiB) +, 384 KiB (393,216 B, 0.375 MiB) + and 512 KiB (524,288 B, 0.5 MiB) +
l1d$ description4-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +, 192 KiB (196,608 B, 0.188 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l1i$ description2-way set associative + and 4-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +, 192 KiB (196,608 B, 0.188 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) + and 0.75 MiB (768 KiB, 786,432 B, 7.324219e-4 GiB) +
ldateMarch 2019 +
main imageFile:sd 855 (front).png +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels4 +
microarchitectureCortex-A55 + and Cortex-A76 +
model numberSDM855 +
nameQualcomm Snapdragon 855 +
part numberSM8150 +
process7 nm (0.007 μm, 7.0e-6 mm) +
series800 +
smp max ways1 +
supported memory typeLPDDR4X-4266 +
technologyCMOS +
thread count8 +
transistor count6,700,000,000 +
used byAsus ROG Phone 2 +, Asus Zenfone 6 +, Asus Zenfone 6Z +, Blackshark 2 SKywalker +, Google Pixel 4/XL +, LG G8 ThinQ +, LG G8S ThinQ +, LG G8X ThinQ +, LG V50 ThinQ +, LG V50S ThinQ +, Lenovo Z5 Pro GT +, Lenovo Z6 Pro +, Meizu 16s +, Microsoft Surface Duo +, OPPO Reno 10x Zoom +, OnePlus 7 +, OnePlus 7 Pro +, OnePlus 7T +, OnePlus 7T Pro +, Oppo Reno 10x Zoom +, Realme X2 PRO +, Samsung Galaxy A90 5G +, Samsung Galaxy Fold +, Samsung Galaxy Note 10 +, Samsung Galaxy Note 10+ +, Samsung Galaxy S10 +, Samsung Galaxy S10 5G +, Samsung Galaxy S10 Lite +, Samsung Galaxy S10+ +, Samsung Galaxy S10e +, Samsung Galaxy Tab S6 +, Sharp Aquos R3 +, Sony Xperia 1 +, Sony Xperia 5 +, VIVO IQOO +, Xiaomi Mi 9 +, Xiaomi Mi 9T Pro +, Xiaomi Mi MIX 3 5G Edition +, Xiaomi Poco X3 Pro +, Xiaomi Redmi K20 Pro +, ZTE Axon 10 Pro + and ZTE Nubia Red Magic 3 +
word size64 bit (8 octets, 16 nibbles) +