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{{mediatek title|Helio X27 (MT6797X)}}
 
{{mediatek title|Helio X27 (MT6797X)}}
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{{chip
+
{{mpu
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|name=MediaTek Helio X27
+
| name               = MediaTek Helio X27
−
|no image=Yes
+
| no image           = yes
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|designer=MediaTek
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| image              =
−
|designer 2=ARM Holdings
+
| image size          =
−
|manufacturer=TSMC
+
| caption            =  
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|model number=Helio X27
+
| designer           = MediaTek
−
|part number=MT6797X
+
| designer 2         = ARM Holdings
−
|part number 2=MTK6797X
+
| manufacturer       = TSMC
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|market=Mobile
+
| model number       = Helio X27
−
|market 2=Embedded
+
| part number         = MT6797X
−
|first announced=December 2, 2016
+
| part number 2       = MTK6797X
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|first launched=December 2, 2016
+
| market             = Mobile
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|family=Helio
+
| market 2           = Embedded
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|series=Helio X
+
| first announced     = December 2, 2016
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|frequency=2,600 MHz
+
| first launched     = December 2, 2016
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|frequency 2=2,000 MHz
+
| last order          =
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|frequency 3=1,600 MHz
+
| last shipment      =
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|bus type=AMBA 4 AXI
+
| release price      =
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|isa=ARMv8
+
 
−
|isa family=ARM
+
| family             = Helio
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|microarch=Cortex-A53
+
| series             = Helio X
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|microarch 2=Cortex-A72
+
| locked              =
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|core name=Cortex-A53
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| frequency           = 2,600 MHz
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|core name 2=Cortex-A72
+
| frequency 2         = 2,000 MHz
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|process=20 nm
+
| frequency 3         = 1,600 MHz
−
|technology=CMOS
+
| bus type           = AMBA 4 AXI
−
|word size=64 bit
+
| bus speed          =
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|core count=10
+
| bus rate            =
−
|thread count=10
+
| bus links          =
−
|max cpus=1
+
| clock multiplier    =
 +
 
 +
| isa family         = ARM
 +
| isa                = ARMv8
 +
| microarch           = Cortex-A53
 +
| microarch 2         = Cortex-A72
 +
| platform            =
 +
| chipset            =
 +
| core name           = Cortex-A53
 +
| core name 2         = Cortex-A72
 +
| core family        =
 +
| core model          =
 +
| core stepping      =
 +
| process             = 20 nm
 +
| transistors        =
 +
| technology         = CMOS
 +
| die area            = <!-- XX mm² -->
 +
| die width          =
 +
| die length          =
 +
| word size           = 64 bit
 +
| core count         = 10
 +
| thread count       = 10
 +
| max cpus           = 1
 +
| max memory          =
 +
 
 +
| electrical          =
 +
| power              =
 +
| v core              =
 +
| v core tolerance    =
 +
| v io                =
 +
| v io 2              =
 +
| v io 3              =
 +
| sdp                =
 +
| tdp                =
 +
| tdp typical        =
 +
| ctdp down          =
 +
| ctdp down frequency =
 +
| ctdp up            =
 +
| ctdp up frequency  =
 +
| temp min            =
 +
| temp max            =
 +
| tjunc min          =
 +
| tjunc max          =
 +
| tcase min          =
 +
| tcase max          =
 +
| tstorage min        = <!-- °C -->
 +
| tstorage max        =
 +
| tambient min        =
 +
| tambient max        =
 +
 
 +
| packaging          =
 +
| package 0          =
 +
| package 0 type      =
 +
| package 0 pins      =
 +
| package 0 pitch    =
 +
| package 0 width    =
 +
| package 0 length    =
 +
| package 0 height    =
 
}}
 
}}
−
'''Helio X27''' ('''MT6797X''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.6 GHz, 2 GHz, and 2.6 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
+
'''Helio X27''' ('''MT6797X''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.6 GHz, 2 GHz, and 2.6 GHz) and supports dual-channel LPDDR3-933. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
  
 
The Helio X27 is identical to {{\\|Helio X20}} with higher CPU clocks speed and higher GPU clock speed. Additionally this model also supports for dual-camera setup[[has feature::Dual-Camera Setup| ]] and MiraVision's EnergySmart Screen technology.
 
The Helio X27 is identical to {{\\|Helio X20}} with higher CPU clocks speed and higher GPU clock speed. Additionally this model also supports for dual-camera setup[[has feature::Dual-Camera Setup| ]] and MiraVision's EnergySmart Screen technology.
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== Memory controller ==
 
== Memory controller ==
 
{{memory controller
 
{{memory controller
−
|type=LPDDR3-1600
+
|type=LPDDR3-933
 
|ecc=No
 
|ecc=No
 
|max mem=4 GiB
 
|max mem=4 GiB
 
|controllers=1
 
|controllers=1
 
|channels=2
 
|channels=2
−
|max bandwidth=11.92 GiB/s
+
|max bandwidth=13.9 GiB/s
−
|bandwidth schan=5.96 GiB/s
+
|bandwidth schan=6.95 GiB/s
−
|bandwidth dchan=11.92 GiB/s
+
|bandwidth dchan=13.9 GiB/s
 
}}
 
}}
  
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| max displays        =  
 
| max displays        =  
 
| max memory          =  
 
| max memory          =  
−
| frequency          = 875 MHz
+
| frequency          = 780 MHz
  
 
| output dsi          = Yes
 
| output dsi          = Yes
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== Utilizing devices ==
 
== Utilizing devices ==
−
* [[used by::Chuwi Hi9 Plus]]
 
 
* [[used by::Doogee F7]]
 
* [[used by::Doogee F7]]
 
* [[used by::Doogee F7 Pro]]
 
* [[used by::Doogee F7 Pro]]
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* [[used by::LeEco Le 2 Pro X620]]
 
* [[used by::LeEco Le 2 Pro X620]]
 
* [[used by::LeEco Le 2 X620]]
 
* [[used by::LeEco Le 2 X620]]
−
* [[used by::LeEco Le Pro 3 AI Edition X650]]
 
 
* [[used by::Meizu MX6]]
 
* [[used by::Meizu MX6]]
−
* [[used by::Planet Computers Gemini]]
 
 
* [[used by::Vernee Apollo Lite]]
 
* [[used by::Vernee Apollo Lite]]
−
* [[used by::UMIDIGI Z PRO]]
+
* [[used by::Xiaomi Redmi Note 4]]
−
* [[used by::Ulefone Gemini Pro]]
 
−
* [[used by::Voyo i8]]
 

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Facts about "Helio X27 (MT6797X) - MediaTek"
RDF feed
base frequency2,600 MHz (2.6 GHz, 2,600,000 kHz) +, 2,000 MHz (2 GHz, 2,000,000 kHz) + and 1,600 MHz (1.6 GHz, 1,600,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A53 + and Cortex-A72 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedDecember 2, 2016 +
first launchedDecember 2, 2016 +
full page namemediatek/helio/mt6797x +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has featureDual-Camera Setup +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuMali-T880 +
integrated gpu base frequency875 MHz (0.875 GHz, 875,000 KHz) +
integrated gpu designerARM Holdings +
integrated gpu execution units4 +
isaARMv8 +
isa familyARM +
ldateDecember 2, 2016 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory bandwidth11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels2 +
microarchitectureCortex-A53 + and Cortex-A72 +
model numberHelio X27 +
nameMediaTek Helio X27 +
part numberMT6797X + and MTK6797X +
process20 nm (0.02 μm, 2.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR3-1600 +
technologyCMOS +
thread count10 +
used byDoogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, Meizu MX6 +, Vernee Apollo Lite +, UMIDIGI Z PRO +, Ulefone Gemini Pro +, Planet Computers Gemini +, LeEco Le Pro 3 AI Edition X650 +, Chuwi Hi9 Plus + and Voyo i8 +
user equipment category6 +
word size64 bit (8 octets, 16 nibbles) +