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− | {{mediatek title|Helio X10 | + | {{mediatek title|Helio X10 (MT6795M)}} |
− | {{ | + | {{mpu |
− | | name = MediaTek Helio X10 | + | | name = MediaTek Helio X10 |
| no image = yes | | no image = yes | ||
| image = | | image = | ||
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| designer 2 = ARM Holdings | | designer 2 = ARM Holdings | ||
| manufacturer = TSMC | | manufacturer = TSMC | ||
− | | model number = Helio X10 | + | | model number = Helio X10 |
| part number = MT6795M | | part number = MT6795M | ||
− | |||
| market = Mobile | | market = Mobile | ||
| market 2 = Embedded | | market 2 = Embedded | ||
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| max memory = 4 GiB | | max memory = 4 GiB | ||
− | + | | electrical = Yes | |
| power = | | power = | ||
| v core = 1 V | | v core = 1 V | ||
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| package 0 height = 0.78 mm | | package 0 height = 0.78 mm | ||
}} | }} | ||
− | '''Helio X10 | + | '''Helio X10''' ('''MT6795M''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[2014]]. This SoC, which incorporates eight {{armh|Cortex-A53}} cores and is manufactured on TSMC's [[28 nm process]], operates at up to 2 GHz and supports dual-channel LPDDR3-933. This chip incorporates the {{imgtec|PowerVR G6200}} [[IGP]] operating at 550 MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 4. |
This SoC is made of 2 clusters of 4-core each ({{armh|Cortex-A53}}) linked together via a {{armh|CCI-400}}, a {{armh|NEON}} engine, and {{armh|Cortex-R4}} core for the second MCU subsystem. | This SoC is made of 2 clusters of 4-core each ({{armh|Cortex-A53}}) linked together via a {{armh|CCI-400}}, a {{armh|NEON}} engine, and {{armh|Cortex-R4}} core for the second MCU subsystem. | ||
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== Memory controller == | == Memory controller == | ||
{{memory controller | {{memory controller | ||
− | |type= | + | |type=DDR3-933 |
|ecc=No | |ecc=No | ||
|max mem=4 GiB | |max mem=4 GiB | ||
|controllers=1 | |controllers=1 | ||
|channels=2 | |channels=2 | ||
− | + | |max bandwidth=13.9 GiB/s | |
− | |max bandwidth=13. | ||
|bandwidth schan=6.95 GiB/s | |bandwidth schan=6.95 GiB/s | ||
− | |bandwidth dchan=13. | + | |bandwidth dchan=13.9 GiB/s |
}} | }} | ||
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| output dsi = Yes | | output dsi = Yes | ||
− | | max res dsi = | + | | max res dsi = 2560x1600 |
| direct3d ver = 10.0 | | direct3d ver = 10.0 | ||
| opencl ver = 1.2 | | opencl ver = 1.2 | ||
| opengl ver = 3.2 | | opengl ver = 3.2 | ||
− | | | + | | opencl es ver = 3.1 |
| vulkan ver = 1.0 | | vulkan ver = 1.0 | ||
}} | }} | ||
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== Wireless == | == Wireless == | ||
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| 2g = Yes | | 2g = Yes | ||
| csd = Yes | | csd = Yes | ||
− | | gsm = | + | | gsm = |
| gprs = Yes | | gprs = Yes | ||
| edge = Yes | | edge = Yes | ||
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| ue cat = 4 | | ue cat = 4 | ||
}} | }} | ||
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Facts about "Helio X10 M (MT6795M) - MediaTek"
base frequency | 2,000 MHz (2 GHz, 2,000,000 kHz) + |
bus type | AMBA 4 AXI + |
core count | 8 + |
core name | Cortex-A53 + |
core voltage | 1 V (10 dV, 100 cV, 1,000 mV) + |
designer | MediaTek + and ARM Holdings + |
family | Helio + |
first announced | July 15, 2014 + |
first launched | March 27, 2015 + |
full page name | mediatek/helio/mt6795m + |
has 2g support | true + |
has 3g support | true + |
has 4g support | true + |
has csd support | true + |
has dc-hsdpa support | true + |
has e-utran support | true + |
has ecc memory support | false + |
has edge support | true + |
has gprs support | true + |
has gsm support | true + |
has hsupa support | true + |
has lte advanced support | true + |
has td-scdma support | true + |
has umts support | true + |
instance of | microprocessor + |
integrated gpu | PowerVR G6200 + |
integrated gpu base frequency | 550 MHz (0.55 GHz, 550,000 KHz) + |
integrated gpu designer | Imagination Technologies + |
io voltage | 1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) + |
isa | ARMv8 + |
isa family | ARM + |
l1$ size | 512 KiB (524,288 B, 0.5 MiB) + |
l1d$ description | 4-way set associative + |
l1d$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l1i$ description | 2-way set associative + |
l1i$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l2$ description | 16-way set associative + |
l2$ size | 2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) + |
ldate | March 27, 2015 + |
manufacturer | TSMC + |
market segment | Mobile + and Embedded + |
max cpu count | 1 + |
max junction temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
max memory | 4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) + |
max memory bandwidth | 13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) + |
max memory channels | 2 + |
max operating temperature | 80 °C + |
max storage temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
microarchitecture | Cortex-A53 + |
min operating temperature | -20 °C + |
min storage temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | Helio X10 M + |
name | MediaTek Helio X10 M + |
part number | MT6795M + and MTK6795M + |
process | 28 nm (0.028 μm, 2.8e-5 mm) + |
series | Helio X + |
smp max ways | 1 + |
supported memory type | LPDDR3-1866 + |
technology | CMOS + |
thread count | 8 + |
used by | HTC One E9 +, HTC One E9+ +, iOcean Z1 + and Xiaomi Redmi Note 2 + |
user equipment category | 4 + |
word size | 64 bit (8 octets, 16 nibbles) + |