Editing loongson/godson 2/2g

{{loongson title|Godson-2G}}
{{chip
| name                = Godson-2G
| image               = godson-2g.jpg
| image size          = 250px
| caption             = Godson-2G chip
| designer            = Loongson
| manufacturer        = STMicroelectronics
| model number        = 2G
| part number         = 
| part number 2       = 
| market              = Desktop
| first announced     = April, 2009
| first launched      = November, 2010
| last order          = 
| last shipment       = 
| release price       = 

| family              = Godson 2
| series              = Godson 2
| locked              = 
| frequency           = 1,000 MHz
| frequency 2         = 
| frequency N         = 
| bus type            = HyperTransport 1.0
| bus speed           = 400 MHz
| bus rate            = 
| bus links           = 
| clock multiplier    = 2.5

| isa family          = MIPS
| isa                 = MIPS64
| microarch           = GS464
| platform            = 
| chipset             = 
| core name           = GS464
| core family         = 
| core model          = 
| core stepping       = 
| process             = 65 nm
| transistors         = 100,000,000
| technology          = CMOS
| die area            = 53.54 mm²
| die width           = 
| die length          = 
| word size           = 64 bit
| core count          = 1
| thread count        = 1
| max cpus            = 1
| max memory          = 


| power               = 3 W
| v core              = 
| v core tolerance    = <!-- OR ... -->
| v core min          = 
| v core max          = 
| v io                = 
| v io tolerance      = 
| v io 2              = <!-- OR ... -->
| v io 3              = 
| sdp                 = 
| tdp                 = 
| tdp typical         = 
| ctdp down           = 
| ctdp down frequency = 
| ctdp up             = 
| ctdp up frequency   = 
| temp min            = 
| temp max            = 
| tjunc min           = <!-- .. °C -->
| tjunc max           = 
| tcase min           = 
| tcase max           = 
| tstorage min        = 
| tstorage max        = 
| tambient min        = 
| tambient max        = 

| packaging           = Yes
| package 0           = FCBGA-741
| package 0 type      = FCBGA
| package 0 pins      = 741
| package 0 pitch     = 
| package 0 width     = 31 mm
| package 0 length    = 31 mm
| package 0 height    = 
| socket 0            = BGA-741
| socket 0 type       = BGA
}}
'''Godson-2G''' ('''龙芯2G''') is a {{arch|64}} [[MIPS]] performance processor developed by [[Institute of Computing Technology of the Chinese Academy of Sciences|ICT]] and later [[Loongson]] for desktop computers. Introduced in late-[[2010]], the Godson-2G operates at up to 1 GHz consuming up to 3 W. This chip was manufactured on [[STMicroelectronics]]' [[65 nm process]].

This specific models incorporates a considerably larger [[2nd level cache]] compared to the rest of the {{\\\|Godson 2}} family along with an extended number of additional interfaces in a relatively large package. The Godson-2G integrates the majority of the [[southbridge]] on-die.

== Cache ==
{{main|loongson/microarchitectures/GS464#Memory_Hierarchy|l1=GS464 § Cache}}
{{cache size
|l1 cache=128 KiB
|l1i cache=64 KiB
|l1i break=1x64 KiB
|l1i desc=4-way set associative
|l1d cache=64 KiB
|l1d break=1x64 KiB
|l1d desc=4-way set associative
|l1d policy=
|l2 cache=1 MiB
|l2 break=1x1 MiB
|l2 desc=4-way set associative
|l2 policy=
}}

== Memory controller ==
{{memory controller
|type=DDR3-800
|ecc=Yes
|max mem=4 GiB
|controllers=1
|channels=1
|max bandwidth=11.92 GiB/s
|bandwidth schan=11.92 GiB/s
}}

== Expansions ==
This chip has integrated [[HyperTransport]] 1.0 operating at 400 MHz.
{{expansions
|pci width  = 32 bit
|pci clock = 66 MHz
|pcix width = 32 bit
|pcix clock = 133 MHz
|lpc revision=1.1
}}

== Die Shot ==
* [[65 nm process]]
* 100,000,000 transistors
* 53.54 mm² die size
[[File:godson-2g die shot.png|700px]]

== References ==
* Zhao, Ji-Ye, et al. "Physical Design Methodology for Godson-2G Microprocessor." Journal of Computer Science and Technology 25.2 (2010): 225-231.
* Weiwu Hu, Yunji Chen. "GS464V: A High-Performance Low-Power XPU with 512-Bit Vector Extension". HotChips 22 (2010).
* Loongson Technology, "龙芯芯片产品技术白皮书" ("Godson chip product technology white paper")
base frequency	1,000 MHz (1 GHz, 1,000,000 kHz) +
bus speed	400 MHz (0.4 GHz, 400,000 kHz) +
bus type	HyperTransport 1.0 +
clock multiplier	2.5 +
core count	1 +
core name	GS464 +
designer	Loongson +
die area	53.54 mm² (0.083 in², 0.535 cm², 53,540,000 µm²) +
family	Godson 2 +
first announced	April 2009 +
first launched	November 2010 +
full page name	loongson/godson 2/2g +
has ecc memory support	true +
instance of	microprocessor +
isa	MIPS64 +
isa family	MIPS +
l1$ size	128 KiB (131,072 B, 0.125 MiB) +
l1d$ description	4-way set associative +
l1d$ size	64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description	4-way set associative +
l1i$ size	64 KiB (65,536 B, 0.0625 MiB) +
l2$ description	4-way set associative +
l2$ size	1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
ldate	November 2010 +
main image	+
main image caption	Godson-2G chip +
manufacturer	STMicroelectronics +
market segment	Desktop +
max cpu count	1 +
max memory bandwidth	11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels	1 +
microarchitecture	GS464 +
model number	2G +
name	Godson-2G +
power dissipation	3 W (3,000 mW, 0.00402 hp, 0.003 kW) +
process	65 nm (0.065 μm, 6.5e-5 mm) +
series	Godson 2 +
smp max ways	1 +
supported memory type	DDR3-800 +
technology	CMOS +
thread count	1 +
transistor count	100,000,000 +
word size	64 bit (8 octets, 16 nibbles) +