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{{hisilicon title|K3V2E}} | {{hisilicon title|K3V2E}} | ||
− | {{ | + | {{mpu |
|name=K3V2E | |name=K3V2E | ||
|no image=Yes | |no image=Yes | ||
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|part number=Hi3620 | |part number=Hi3620 | ||
|market=Mobile | |market=Mobile | ||
− | |first announced= | + | |first announced=2012 |
− | |first launched= | + | |first launched=2012 |
|family=K3 | |family=K3 | ||
|frequency=1,500 MHz | |frequency=1,500 MHz | ||
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|package module 1={{packages/hisilicon/tfbga-576}} | |package module 1={{packages/hisilicon/tfbga-576}} | ||
}} | }} | ||
− | '''K3V2E''' is a {{arch|32}} [[quad-core]] mobile [[ARM]] microprocessor introduced by [[HiSilicon]] in [[ | + | '''K3V2E''' is a {{arch|32}} [[quad-core]] mobile [[ARM]] microprocessor introduced by [[HiSilicon]] in late [[2012]]. This chip, which is fabricated on a [[40 nm process]], incorporates four {{armh|Cortex-A9|l=arch}} cores operating at 1.5 GHz. The K3V2 integrated [[Vivante]]'s {{vivante|GC4000}} (16 cores) [[IGP]] and supports up to 2 channels of LPDDR2-900 memory. The K3V2E is an enhanced version of the {{\\|K3V2}}, although the exact changes are not well-documented. |
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Facts about "K3V2E - HiSilicon"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | K3V2E - HiSilicon#package + |
base frequency | 1,500 MHz (1.5 GHz, 1,500,000 kHz) + |
core count | 4 + |
core name | Cortex-A9 + |
designer | HiSilicon + and ARM Holdings + |
family | K3 + |
first announced | 2013 + |
first launched | 2013 + |
full page name | hisilicon/k3/k3v2e + |
has ecc memory support | false + |
instance of | microprocessor + |
integrated gpu | GC4000 + |
integrated gpu base frequency | 480 MHz (0.48 GHz, 480,000 KHz) + |
integrated gpu designer | Vivante + |
integrated gpu execution units | 16 + |
isa | ARMv7 + |
isa family | ARM + |
l1$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l1d$ description | 4-way set associative + |
l1d$ size | 128 KiB (131,072 B, 0.125 MiB) + |
l1i$ description | 4-way set associative + |
l1i$ size | 128 KiB (131,072 B, 0.125 MiB) + |
l2$ description | 8-way set associative + |
l2$ size | 1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + |
ldate | 2013 + |
manufacturer | TSMC + |
market segment | Mobile + |
max cpu count | 1 + |
max memory bandwidth | 6.71 GiB/s (6,871.04 MiB/s, 7.205 GB/s, 7,204.808 MB/s, 0.00655 TiB/s, 0.0072 TB/s) + |
max memory channels | 2 + |
microarchitecture | Cortex-A9 + |
model number | K3V2E + |
name | K3V2E + |
package | TFBGA-576 + |
part number | Hi3620 + |
process | 40 nm (0.04 μm, 4.0e-5 mm) + |
smp max ways | 1 + |
supported memory type | LPDDR2-900 + |
technology | CMOS + |
thread count | 4 + |
transistor count | 600,000,000 + |
used by | Huawei HN3-U01 +, Huawei Ascend P6 +, Ascend W2 + and Huawei Honor 3 + |
word size | 32 bit (4 octets, 8 nibbles) + |