Editing amd/packages/fp2

{{amd title|Package FP2}}
{{package
|name=Package FP2
|designer=AMD
|market=Mobile
|market 2=Embedded
|first launched=May 15, 2012
|microarch=Piledriver
|tdp=25 W
|package name=FP2
|package name 2=BGA-827
|package type=Organic Micro Ball Grid Array
|package contacts=827
|package dimension=31 mm
|package dimension 2=27 mm
|package pitch=0.8 mm
}}

'''FP2''' was a BGA-827 package for [[AMD]] mobile and embedded microprocessors with integrated graphics, the BGA counterpart to the PGA-722 package for {{\\|Socket FS1r2}}. For desktop processors AMD developed {{\\|Socket FM2}}. FP2 was superseded by the {{\\|FP3}} package.

Package FP2 was used in AMD's "Comal" mobile platform. All processors in the FP2 package, codename "Trinity" and "Richland", are members of AMD's Family 15h with CPU cores based on the {{amd|Piledriver|l=arch}} microarchitecture, and were fabricated on a 32 nm SOI process.


=== Features ===
* 827-pin lidless micro ball grid array package, 0.8-1.2 mm multi-pitch, 31 × 27 mm, organic substrate

* 2 × 64 bit DDR3 SDRAM interface up to 800 MHz, PC3-12800 (DDR3-1600), 25.6 GB/s
** Up to 2 SR UDIMMs or SODIMMs (1 per channel), no ECC support
** JEDEC 1.5V, 1.35V, 1.25V
** AMD Memory Controller PowerCap

* PCIe Gen 1.0 and 2.0 (5 GT/s)
** Configurable x8 or x16 external graphics card (GFX) link
** Configurable x4 General Purpose Ports
** x4 Unified Media Interface to FCH

* Four independent display controllers
** Six Digital Display Interfaces
*** 3 × single link
*** 3 × multiplexed, presumably each with 1x4 (dual link DVI 1x8) GFX lanes or 1x4 UMI lanes
** DisplayPort 1.2 up to 4096 × 2160 at 30 Hz and 30 bpp, eDP, DP++, DP audio, HDCP
** Single/dual link DVI 1.4a up to 2560 × 1600 at 60 Hz and 24 bpp, HDCP
** HDMI 1.4a up to 1920 × 1200 at 60 Hz and 24 bpp, 3D Video, HDCP
** VGA via FCH DP-DAC

* Power Management
** AMD AllDay power technology
** ACPI P-states, processor power states C0, C1, C1E, C6, sleep states S0, S3, S4, S5
** PCIe core power gating
** PCIe speed power policy
** AMD Turbo CORE technology 3.0 with per core power gating

* Thermal Controls
** Sideband temperature control (SB-TSI)
** Hardware thermal control (HTC)
** Local hardware thermal control (LHTC)
** DRAM thermal protection

== Chipsets ==
* AMD FCH A50M/A60M/A55T/A70M/A68M, codename "Hudson-M1/M2/M2T/M3/M3L"
* AMD FCH A76M, codename "Bolton-M3"

== Processors using package FP2 ==
* AMD A-Series 4000 Mobile APU
* AMD A-Series 5000 Mobile APU
* AMD Embedded R-Series APU
<!-- AMD Publ. #48931 also mentions AMD R-Series Processor (iGPU disabled), OPN? -->

<!-- NOTE:
           This table is generated automatically from the data in the actual articles.
           If a microprocessor is missing from the list, an appropriate article for it needs to be
           created and tagged accordingly.

           Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
-->
{{comp table start}}
<table class="comptable sortable tc13 tc14 tc15 tc16 tc17 tc18 tc19">
<tr class="comptable-header"><th>&nbsp;</th><th colspan="19">List of all FP2-based Processors</th></tr>
{{comp table header 1|cols=Price, Process, Launched, µarch, Family, Core, C, T, Freq, Turbo, TDP}}
{{#ask: [[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::FP2]]
 |?full page name
 |?model number
 |?release price
 |?process
 |?first launched
 |?microarchitecture
 |?microprocessor family
 |?core name
 |?core count
 |?thread count
 |?base frequency#GHz
 |?turbo frequency (1 core)#GHz
 |?tdp
 |format=template
 |template=proc table 3
 |userparam=13
 |mainlabel=-
}}
{{comp table count|ask=[[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::FP2]]}}
</table>
{{comp table end}}

== Package Diagram ==
:[[File:BGA-827 diag.svg]]

Approximate dimensions of the Trinity package. All dimensions in millimeters.

:[[File:BGA-827 pn.svg|800px]]

FP2 package ball numbers.

== Pin Map ==
:[[File:BGA-827 pinmap.svg|800px]]

== References ==
* "Family 15h Models 10h - 1Fh AMD A-Series Mobile Accelerated Processor Product Data Sheet", AMD Publ. #50909, Rev. 3.03, November 29, 2012
* "Family 15h Models 10h - 1Fh AMD Embedded R-Series Accelerated Processor Product Data Sheet", AMD Publ. #51309, Rev. 3.01, November 28, 2012
* "Revision Guide for AMD Family 15h Models 10h-1Fh Processors", AMD Publ. #48931, Rev. 3.10, May 2013
* "Product Brief: AMD Embedded R-Series Platform", AMD Publ. #51954, Rev. C, 2013

== See also ==
* {{\\|Socket FS1r2}}
* {{\\|Socket FM2}}
* {{\\|FP3|Package FP3}}

[[Category:amd]]
designer	AMD +
first launched	May 15, 2012 +
instance of	package +
market segment	Mobile + and Embedded +
microarchitecture	Piledriver +
name	Package FP2 +
package	BGA-827 + and FP2 +
package contacts	827 +
package length	31 mm (3.1 cm, 1.22 in) +
package pitch	0.8 mm (0.0315 in) +
package type	Organic Micro Ball Grid Array +
package width	27 mm (2.7 cm, 1.063 in) +
tdp	25 W (25,000 mW, 0.0335 hp, 0.025 kW) +