Editing amd/packages/asb2

{{amd title|Package ASB2}}
{{package
|name=ASB2
|designer=AMD
|market=Mobile
|first launched=May 12, 2010
|microarch=K10
|tdp=15 W
|package name=ASB2
|package type=Organic Micro Ball Grid Array
|package contacts=812
|package dimension=27 mm
|package dimension 2=27 mm
|package pitch=0.8 mm
}}

'''ASB2''' was a BGA-812 package for low power [[AMD]] mobile microprocessors with an
integrated DDR3 memory controller targeting the small form factor desktop, mobile and embedded market.
ASB2 was the successor to the {{\\|ASB1}} package. Its counterparts for the mainstream mobile and desktop markets are 
{{\\|Socket S1g4}} and {{\\|Socket AM3}}. ASB2 was superseded by the {{\\|FT1}} package.

Package ASB2 was used in AMD's "Nile" platform for ultrathin notebooks.
All ASB2 processors belong to AMD's Family 10h based on the [[amd/microarchitectures/k10|K10 microarchitecture]],
codename "Geneva", and were manufactured in a 45 nm SOI process.

Package ASB1 and ASB2 appear to have the same dimensions but are electrically incompatible.

=== Features ===
* 812-pin lidless micro ball grid array package, 0.8-1.6 mm multi-pitch, 33 × 33 pins, 27 × 27 mm, organic substrate
* 16 bit [[HyperTransport]] 3.0 interface up to 1.6 GHz, 3200 MT/s, 6.8 Gbyte/s in each direction
* 2 × 64/72 bit DDR3 SDRAM interface (unganged only) up to 533 MHz, PC3-8500 (DDR3-1066), 17.0 Gbyte/s
** Up to 2 SODIMMs, SEC-DED ECC
** JEDEC 1.35V (DDR3L), 1.5V
* Core and NB P-States; ACPI C0, C1, C1E, S0, S1, S3, S4, S5; Separate core and NB power planes
* Thermal diode, overtemperature protection

== Chipsets ==
* AMD RS880M

== Processors using package ASB2 ==
<!-- AMD-41322-3.92; CPUID 00100F63h, rev. DA-C3 -->
* AMD Turion II Neo Dual-Core
* AMD Athlon II Neo Dual-Core
* AMD Athlon II Neo
* AMD V-Series Dual-Core
* AMD V-Series

<!-- NOTE:
           This table is generated automatically from the data in the actual articles.
           If a microprocessor is missing from the list, an appropriate article for it needs to be
           created and tagged accordingly.

           Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
-->
{{comp table start}}
<table class="comptable sortable tc13 tc14 tc15 tc16 tc17 tc18 tc19">
<tr class="comptable-header"><th>&nbsp;</th><th colspan="19">List of all ASB2-based Processors</th></tr>
{{comp table header 1|cols=Price, Process, Launched, µarch, Family, Core, C, T, Freq, Turbo, TDP}}
{{#ask: [[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::ASB2]]
 |?full page name
 |?model number
 |?release price
 |?process
 |?first launched
 |?microarchitecture
 |?microprocessor family
 |?core name
 |?core count
 |?thread count
 |?base frequency#GHz
 |?turbo frequency (1 core)#GHz
 |?tdp
 |format=template
 |template=proc table 3
 |userparam=13
 |mainlabel=-
}}
{{comp table count|ask=[[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::ASB2]]}}
</table>
{{comp table end}}

== Package Diagram ==
:[[File:BGA-812 ASB2 30532 diag.svg]]

No data available. Approximate dimensions of the Athlon II Neo package. All dimensions in millimeters.

:[[File:BGA-812 pn.svg|800px]]

BGA-812 package pin (ball) numbering.

== Pin Map ==
:[[File:BGA-812 ASB2 pinmap.svg|800px]]

== References ==
* "BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors", AMD Publ. #31116, Rev. 3.48, April 22, 2010
* "Revision Guide for AMD Family 10h Processors", AMD Publ. #41322, Rev. 3.92, March 2012
* [https://web.archive.org/web/20100515120931/http://www.amd.com/us/products/notebook/platforms/home/2010-ultrathin/Pages/2010-ultrathin-platform.aspx The 2010 AMD Ultrathin Platform], amd.com, archived May 2010

== See also ==
* {{\\|ASB1}}
* {{\\|FT1}}
* {{\\|Socket S1g4}}
* {{\\|Socket AM3}}

[[Category:amd]]
designer	AMD +
first launched	May 12, 2010 +
instance of	package +
market segment	Mobile +
microarchitecture	K10 +
name	ASB2 +
package	ASB2 +
package contacts	812 +
package length	27 mm (2.7 cm, 1.063 in) +
package pitch	0.8 mm (0.0315 in) +
package type	Organic Micro Ball Grid Array +
package width	27 mm (2.7 cm, 1.063 in) +
tdp	15 W (15,000 mW, 0.0201 hp, 0.015 kW) +