Semiconductor & Computer Engineering
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'''Flip Chip Ball Grid Array''' ('''fcBGA''' or simply ''Flip-chip BGA'') is a mid-cost, high-performance, [[Semiconductor package|semiconductor packaging]] solution that utilizes the [[controlled collapse chip connection]] technology, also known as [[flip chip]], for its [[die]] to [[substrate]] interconnection. fcBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. fcBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can be replaced using existing standard repair practices. | '''Flip Chip Ball Grid Array''' ('''fcBGA''' or simply ''Flip-chip BGA'') is a mid-cost, high-performance, [[Semiconductor package|semiconductor packaging]] solution that utilizes the [[controlled collapse chip connection]] technology, also known as [[flip chip]], for its [[die]] to [[substrate]] interconnection. fcBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. fcBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can be replaced using existing standard repair practices. | ||
| − | [[File:Typical Flip Chip BGA Package (Cross-Sectional View).png|thumb|350px|right|Typical Flip Chip BGA Package (Cross-Sectional View)]] | + | [[File:Typical Flip Chip BGA Package (Cross-Sectional View).png|thumb|350px|right|Typical [[Flip Chip BGA]] Package (Cross-Sectional View)]] |
Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally fcBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively [[Application-specific integrated circuit|ASIC]], [[Digital signal processor|DSP]], and various other high performance applications. | Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally fcBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively [[Application-specific integrated circuit|ASIC]], [[Digital signal processor|DSP]], and various other high performance applications. | ||
fcBGA packages is used in all main semiconductor manufacturers such as in the latest [[Intel]]'s [[Core i7]], [[Texas Instruments]] custom [[ASIC]]s, and [[Freescale]] processors. | fcBGA packages is used in all main semiconductor manufacturers such as in the latest [[Intel]]'s [[Core i7]], [[Texas Instruments]] custom [[ASIC]]s, and [[Freescale]] processors. | ||
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== μFCBGA == | == μFCBGA == | ||