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| | {{lithography processes}} | | {{lithography processes}} |
| − | The '''65 nanometer (65 nm) lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[80 nm lithography process|80 nm process]] stopgap. Commercial [[integrated circuit]] manufacturing using 65 nm process began in 2005. This technology was superseded by the [[55 nm lithography process|55 nm process]] (HN) / [[45 nm lithography process|45 nm process]] (FN) in 2007. | + | The '''65 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[80 nm lithography process|80 nm process]]. Commercial [[integrated circuit]] manufacturing using 65 nm process began in 2006. This technology was superseded by the [[55 nm lithography process|55 nm process]] (HN) / [[45 nm lithography process|45 nm process]] (FN) in 2007. |
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| − | == Industry == | + | == 65 nm Microprocessors== |
| − | {{scrolling table/top|style=text-align: right; | first=Fab
| + | {{expand list}} |
| − | |Process Name
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| − | |1st Production
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| − | |Wafer
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| − | |Metal Layers
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| − | |
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| − | |Contacted Gate Pitch
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| − | |Interconnect Pitch (M1P)
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| − | |SRAM bit cell (HD)
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| − | |SRAM bit cell (LP)
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| − | |DRAM bit cell
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| − | }}
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| − | {{scrolling table/mid}}
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| − | |-
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| − | ! colspan="2" | [[Intel]] !! colspan="2" | [[IBM]] / [[Toshiba]] / [[Sony]] / [[AMD]] !! colspan="2" | [[TI]] !! colspan="2" | [[IBM]] / [[Chartered]] / [[Infineon]] / [[Samsung]] !! colspan="2" | [[TSMC]] !! colspan="2" | [[Fujitsu]]
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| − | |- style="text-align: center;"
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| − | | colspan="2" | P1264 || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | CS-200/CS-201/CS-250
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| − | |- style="text-align: center;"
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| − | | colspan="2" | 2005 || colspan="2" | 2005 || colspan="2" | 2007 || colspan="2" | 2005 || colspan="2" | 2005 || colspan="2" | 2006
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| − | |- style="text-align: center;"
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| − | | colspan="12" | 300mm
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| − | |- style="text-align: center;"
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| − | | colspan="2" | 8 || colspan="2" | 10 || colspan="2" | 11 || colspan="2" | 10 || colspan="2" | || colspan="2" | 11
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| − | |-
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| − | ! Value !! [[90 nm]] Δ !! Value !! [[90 nm]] Δ !! Value !! [[90 nm]] Δ !! Value !! [[90 nm]] Δ !! Value !! [[90 nm]] Δ !! Value !! [[90 nm]] Δ
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| − | |-
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| − | | 220 nm || 0.85x || 250 nm || ?x || ? nm || ?x || 200 nm || 0.82x || 160 nm || 0.67x || ? nm || ?x
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| − | |-
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| − | | 210 nm || 0.95x || ? nm || ?x || ? nm || ?x || 180 nm || 0.73 || 180 nm || 0.75x || ? nm || ?x
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| − | |-
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| − | | 0.570 µm² || 0.57x || 0.540 µm² || || 0.49 µm² || || 0.540 µm² || 0.55x || 0.499 µm² || 0.50x || ||
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| − | |-
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| − | | 0.680 µm² || || 0.65 µm² || 0.65x || 0.49 µm² || || 0.676 µm² || 0.54x || 0.525 µm² || 0.53x || ? µm² || ?x
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| − | |-
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| − | | || || 0.127 µm² || 0.67x || || || 0.189 µm² || 0.69x || || || ||
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| − | {{scrolling table/end}} | |
| − | === Design Rules ===
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| − | {| class="wikitable collapsible collapsed"
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| − | |-
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| − | ! colspan="4" | Intel 65nm Design Rules
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| − | |-
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| − | ! Layer !! Pitch !! Thick !! Aspect Ratio
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| − | |-
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| − | | Isolation || 220 nm || 320 nm || -
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| − | |-
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| − | | Polysilicon || 220 nm || 90 nm || -
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| − | |-
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| − | | Contacted Gate || 220 nm || || -
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| − | |-
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| − | | Metal 1 || 210 nm || 170 nm || 1.6
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| − | |-
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| − | | Metal 2 || 210 nm || 190 nm || 1.8
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| − | |-
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| − | | Metal 3 || 220 nm || 200 nm || 1.8
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| − | |-
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| − | | Metal 4 || 280 nm || 250 nm || 1.8
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| − | |-
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| − | | Metal 5 || 330 nm || 300 nm || 1.8
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| − | |-
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| − | | Metal 6 || 480 nm || 430 nm || 1.8
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| − | |-
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| − | | Metal 7 || 720 nm || 650 nm || 1.8
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| − | |-
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| − | | Metal 8 || 1.80 µm || 975 nm || 1.8
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| − | |}
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| | | | |
| − | == 65 nm Microprocessors== | + | == 65 nm System on Chips== |
| − | * AMD
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| − | ** {{amd|Athlon 64 X2}}
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| − | ** {{amd|Athlon X2}}
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| − | ** {{amd|Opteron}}
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| − | ** {{amd|Phenom}}
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| − | ** {{amd|Turion 64 X2}}
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| − | * Fujitsu
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| − | ** {{fujitsu|SPARC64 VII}}
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| − | * IBM
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| − | ** {{ibm|Power6}}
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| − | * Intel
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| − | ** {{intel|Celeron}}
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| − | ** {{intel|Core 2 Duo}}
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| − | ** {{intel|Core 2 Extreme}}
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| − | ** {{intel|Core 2 Quad}}
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| − | ** {{intel|Core 2 Quad Extreme}}
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| − | ** {{intel|Core Duo}}
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| − | ** {{intel|Pentium 4}}
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| − | ** {{intel|Pentium D}}
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| − | ** {{intel|Pentium Extreme Edition}}
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| − | ** {{intel|Pentium Dual-Core}}
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| − | ** {{intel|Xeon}}
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| − | * Loongson
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| − | ** {{loongson|Godson 2}}
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| − | * Qualcomm
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| − | ** {{qualcomm|MSM6xxx}}
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| − | * Sun
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| − | ** {{sun|UltraSPARC T2}}
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| | {{expand list}} | | {{expand list}} |
| | | | |
| | == 65 nm Microarchitectures == | | == 65 nm Microarchitectures == |
| − | * AMD
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| − | ** {{amd|K8|l=arch}}
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| − | ** {{amd|K10|l=arch}}
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| − | * ARM
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| − | ** {{armh|ARM7|l=arch}}
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| − | * IBM
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| − | ** {{ibm|z10|l=arch}}
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| | * Intel | | * Intel |
| − | ** {{intel|Core|l=arch}} | + | ** {{intel|Core (arch)|Core}} |
| − | * Movidius
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| − | ** {{movidius|SHAVE v2.0|l=arch}}
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| − | * VIA Technologies
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| − | ** {{via|Isaiah|l=arch}}
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| | {{expand list}} | | {{expand list}} |
| − |
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| − | == Documents ==
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| − | * [[:File:samsung foundry - 45, 65, 90 (August, 2007).pdf|Samsung foundry - 45 nm, 65 nm, 90 nm guide (August, 2007)]]
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| − |
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| − | [[category:lithography]]
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