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Editing 250 nm lithography process
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== Industry == | == Industry == | ||
− | The 0.25 µm-based process entered production at [[Intel]] in 1997. Intel original 0.25 micron process was named ''P856'' or ''Process 856''. A second process, named ''P856.5'', was a 5% linear shrink of the original design rules. The shrink, which enabled a high equipment re-use resulted in a smaller, 9.26 µm², 6T SRAM. The process used 200 mm [[wafer]]s, [[Wikipedia:SiO2|SiO<sub>2</sub>]] dielectric and [[wikipedia:polysilicon|polysilicon]] | + | The 0.25 µm-based process entered production at [[Intel]] in 1997. Intel original 0.25 micron process was named ''P856'' or ''Process 856''. A second process, named ''P856.5'', was a 5% linear shrink of the original design rules. The shrink, which enabled a high equipment re-use resulted in a smaller, 9.26 µm², 6T SRAM. The process used 200 mm [[wafer]]s, [[Wikipedia:SiO2|SiO<sub>2</sub>]] dielectric and [[wikipedia:polysilicon|polysilicon]] electode. It used [[wikipedia:Aluminium|Al]] inter-connects and an [[wikipedia:Silicon|Si]] channels. |
{{scrolling table/top|style=text-align: right; | first=Fab | {{scrolling table/top|style=text-align: right; | first=Fab | ||
|Process Name | |Process Name | ||
|1st Production | |1st Production | ||
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|Metal Layers | |Metal Layers | ||
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| colspan="2" | 1997 || colspan="2" | 1998 || colspan="2" | 1997 || colspan="2" | 1998 || colspan="2" | 1999 || colspan="2" | ? || colspan="2" | ? || colspan="2" | ? || colspan="2" | ? || colspan="2" | 1998 || colspan="2" | 1998 || colspan="2" | 1997 || colspan="2" | | | colspan="2" | 1997 || colspan="2" | 1998 || colspan="2" | 1997 || colspan="2" | 1998 || colspan="2" | 1999 || colspan="2" | ? || colspan="2" | ? || colspan="2" | ? || colspan="2" | ? || colspan="2" | 1998 || colspan="2" | 1998 || colspan="2" | 1997 || colspan="2" | | ||
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|- style="text-align: center;" | |- style="text-align: center;" | ||
| colspan="2" | 5 || colspan="2" | 5 || colspan="2" | 5 || colspan="2" | 5 || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | 4 || colspan="2" | || colspan="2" | | | colspan="2" | 5 || colspan="2" | 5 || colspan="2" | 5 || colspan="2" | 5 || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | || colspan="2" | 4 || colspan="2" | || colspan="2" | | ||
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! Value !! [[350 nm]] Δ !! Value !! 250 nm Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ | ! Value !! [[350 nm]] Δ !! Value !! 250 nm Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ !! Value !! [[350 nm]] Δ | ||
|- | |- | ||
− | | 500 nm || 0.91x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || | + | | 500 nm || 0.91x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x |
|- | |- | ||
− | | 640 nm || 0.72x || ? nm || ?x || 700 nm || ?x || 880 nm || ?x || 850 nm || ?x || 840 nm || ?x || 940 nm || ?x || 900 nm || ?x || | + | | 640 nm || 0.72x || ? nm || ?x || 700 nm || ?x || 880 nm || ?x || 850 nm || ?x || 840 nm || ?x || 940 nm || ?x || 900 nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x |
|- | |- | ||
| 10.26 µm² || 0.57x || 9.26 µm² || 0.90x || 8.6 µm² || ?x || ? µm² || ?x || 10.5 µm² || ?x || 11.5 µm² || ?x || 11.2 µm² || ?x || ? µm² || ?x || 7.56 µm² || ?x || ? µm² || ?x || ? µm² || ?x || ? µm² || ?x || 12.77 µm² || ?x | | 10.26 µm² || 0.57x || 9.26 µm² || 0.90x || 8.6 µm² || ?x || ? µm² || ?x || 10.5 µm² || ?x || 11.5 µm² || ?x || 11.2 µm² || ?x || ? µm² || ?x || 7.56 µm² || ?x || ? µm² || ?x || ? µm² || ?x || ? µm² || ?x || 12.77 µm² || ?x | ||
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* Seshan, Krishna, Timothy J. Maloney, and Kenneth J. Wu. "The quality and reliability of Intel's quarter micron process." (1998). | * Seshan, Krishna, Timothy J. Maloney, and Kenneth J. Wu. "The quality and reliability of Intel's quarter micron process." (1998). | ||
* Thompson, Scott. "MOS scaling: Transistor challenges for the 21st century." Intel Technology Journal. 1998. | * Thompson, Scott. "MOS scaling: Transistor challenges for the 21st century." Intel Technology Journal. 1998. | ||
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