Editing tesla (car company)/fsd chip (section)

=== Top bumps ===
* [[Samsung]] [[14 nm process]]
* 12 metal layers
* 12,464 C4 bumps


:[[File:tesla fsd die bumps.png|800px]]
base frequency	2,200 MHz (2.2 GHz, 2,200,000 kHz) +
core count	12 +
core name	Cortex-A72 +
core stepping	B0 +
designer	Tesla (car company) +
die area	260 mm² (0.403 in², 2.6 cm², 260,000,000 µm²) +
die length	20 mm (2 cm, 0.787 in, 20,000 µm) +
die width	13 mm (1.3 cm, 0.512 in, 13,000 µm) +
first announced	April 22, 2019 +
first launched	March 10, 2019 +
full page name	tesla (car company)/fsd chip +
has ecc memory support	true +
instance of	microprocessor +
isa	ARMv8.0-A +
isa family	ARM +
ldate	March 10, 2019 +
main image	+
manufacturer	Samsung +
market segment	Automotive +
max memory	8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth	63.58 GiB/s (65,105.92 MiB/s, 68.269 GB/s, 68,268.505 MB/s, 0.0621 TiB/s, 0.0683 TB/s) +
microarchitecture	Cortex-A72 +
name	FSD Chip +
package	FCBGA-2116 +
process	14 nm (0.014 μm, 1.4e-5 mm) +
supported memory type	LPDDR4-4266 +
tdp	36 W (36,000 mW, 0.0483 hp, 0.036 kW) +
technology	CMOS +
thread count	12 +
transistor count	6,000,000,000 +
word size	64 bit (8 octets, 16 nibbles) +