Editing amd/packages/socket fs1 (section)

=== Features ===
* 722-pin lidless micro pin grid array package, 1.2192 mm (0.048") pitch, 28 × 28 pins, 35 × 35 mm, organic substrate

* 2 × 64 bit DDR3 SDRAM interface up to 800 MHz, PC3-12800 (DDR3-1600), 25.6 GB/s
** Up to 2 SR/DR UDIMMs or SODIMMs (1 per channel), no ECC support
** JEDEC 1.5V, 1.35V

* PCIe Gen 1.0 and 2.0 (5 GT/s)
** Configurable x16 external graphics card (GFX) link (x16, x8, x4, up to 2 ports, DDI)
** Configurable x4 General Purpose Ports (1x4, 2x2, 1x2 + 2x1, 4x1)
** x4 Unified Media Interface to FCH

* Two independent display controllers
** Six Digital Display Interfaces
*** 2 × single link
*** 4 × multiplexed with 1×4 (dual link DVI 1×8) GFX lanes each
** DisplayPort 1.2 / eDP 1.0 up to 2560 × 1600 at 60 Hz and 30 bpp, HDCP, DP++, DP audio
** Single/dual link DVI up to 2560 × 1600 at 60 Hz and 24 bpp, HDCP
** HDMI 1.4a up to 1920 × 1200 at 60 Hz and 30 bpp, HDCP
designer	AMD +
first launched	June 14, 2011 +
instance of	package +
market segment	Mobile +
microarchitecture	K10 +
name	Socket FS1 +
package	OPGA-722 +
package contacts	722 +
package length	35 mm (3.5 cm, 1.378 in) +
package pitch	1.219 mm (0.048 in) +
package type	Organic Micro Pin Grid Array +
package width	35 mm (3.5 cm, 1.378 in) +
socket	Socket FS1 +
tdp	45 W (45,000 mW, 0.0603 hp, 0.045 kW) +