Editing amd/packages/fp3 (section)

=== Features ===
* 854-pin lidless micro ball grid array package, 0.8-1.2 mm multi-pitch, 29 × 32 mm, organic substrate

* 2 × 64/72 bit DDR3 SDRAM interface up to 1067 MHz, PC3-17000 (DDR3-2133), 34.1 GB/s
** Up to 2 SR/DR UDIMMs or SODIMMs (1 per channel), ECC supported
** JEDEC 1.5V, 1.35V, 1.25V
** AMD Memory Controller PowerCap

* PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
** Configurable x16 external graphics card (GFX) link (x16, x8, x4, up to 2 ports, DDI)
* PCIe Gen 1.0, 2.0 (5 GT/s)
** Configurable x8 General Purpose Ports (x4, x2, x1, up to 5 ports, DDI)
** x4 Unified Media Interface to FCH

* Four independent display controllers
** Seven Digital Display Interfaces
*** 3 × single link, dual link DVI by combining DP1:DP0
*** 3 × multiplexed with 1x4 (dual link DVI 1x8) GFX lanes
*** 1 × multiplexed with GPP lanes 7:4
** DisplayPort 1.2 up to 3840 × 2160 at 30 Hz and 24 bpp, HDCP 1.1, DP++, DP audio
** eDP 1.3 up to 1920 × 1080 at 60 Hz and 30 bpp
** Single/dual link DVI up to 2560 × 1600 at 60 Hz and 30 bpp
** HDMI 1.3 up to 4096 × 2160 at 24 Hz and 24 bpp, HDCP 1.3
** VGA via FCH DP-DAC

* Power Management
** AMD PowerNow! technology
** ACPI P-states, processor power states C0, C1, CC6, PC6, sleep states S0, S3, S4, S5
** PCIe power gating
** PCIe speed power policy
** SmartSleep
** AMD Turbo CORE technology with per-core power gating
** Dynamic panel refresh rate, panel self-refresh

* Thermal Controls
** Sideband temperature control
** Hardware thermal control
** DRAM thermal protection
designer	AMD +
first launched	June 2014 +
instance of	package +
market segment	Mobile + and Embedded +
microarchitecture	Steamroller +
name	Package FP3 +
package	BGA-854 + and FP3 +
package contacts	854 +
package length	29 mm (2.9 cm, 1.142 in) +
package pitch	0.8 mm (0.0315 in) +
package type	Organic Micro Ball Grid Array +
package width	32 mm (3.2 cm, 1.26 in) +
tdp	35 W (35,000 mW, 0.0469 hp, 0.035 kW) +