Editing amd/k6-iii-p/amd-k6-iii-400ack (section)

== Cache ==
{{main|amd/microarchitectures/k6-iii#Memory_Hierarchy|l1=K6-III § Cache}}
[[L3$]] can be 512 KiB to 2 MiB, depending on manufacturer and [[motherboard]] model. L3$ is off-chip. L2$ operated at full core speed.
{{cache info
|l1i cache=32 KiB
|l1i break=1x32 KiB
|l1i desc=2-way set associative
|l1i extra=
|l1d cache=32 KiB
|l1d break=1x32 KiB
|l1d desc=2-way set associative
|l1d extra=
|l2 cache=256 KiB
|l2 break=1x256 KiB
|l2 desc=4-way set associative
|l2 extra=(shared)
|l3 cache=
|l3 break=
|l3 desc=
|l3 extra=
}}
base frequency	399.999 MHz (0.4 GHz, 399,999 kHz) +
bus rate	99.99 MT/s (0.1 GT/s, 99,990 kT/s) +
bus speed	99.99 MHz (0.1 GHz, 99,990 kHz) +
bus type	FSB +
clock multiplier	3.5 +
core count	1 +
core family	5 +
core model	9 +
core name	Sharptooth +
core stepping	1 +
core voltage	2 V (20 dV, 200 cV, 2,000 mV) +
core voltage tolerance	0.1 V +
cpuid	591 +
designer	AMD +
die area	118 mm² (0.183 in², 1.18 cm², 118,000,000 µm²) +
family	K6-III-P +
first announced	September 20, 1999 +
first launched	September 20, 1999 +
full page name	amd/k6-iii-p/amd-k6-iii-400ack +
instance of	microprocessor +
io voltage	3.368 V (33.675 dV, 336.75 cV, 3,367.5 mV) +
io voltage tolerance	7% +
l1d$ description	2-way set associative +
l1d$ size	32 KiB (32,768 B, 0.0313 MiB) +
l1i$ description	2-way set associative +
l1i$ size	32 KiB (32,768 B, 0.0313 MiB) +
l2$ description	4-way set associative +
l2$ size	0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) +
ldate	September 20, 1999 +
manufacturer	AMD +
market segment	Mobile +
max case temperature	353.15 K (80 °C, 176 °F, 635.67 °R) +
max cpu count	1 +
max memory	4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max storage temperature	423.15 K (150 °C, 302 °F, 761.67 °R) +
microarchitecture	K6-III +
min case temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature	208.15 K (-65 °C, -85 °F, 374.67 °R) +
model number	AMD-K6-III/400ACK +
name	AMD-K6-III/400ACK +
part number	AMD-K6-III/400ACK +
platform	Super 7 +
power dissipation	16 W (16,000 mW, 0.0215 hp, 0.016 kW) +
process	250 nm (0.25 μm, 2.5e-4 mm) +
series	K6-III Mobile +
smp max ways	1 +
technology	CMOS +
thread count	1 +
transistor count	21,300,000 +
word size	32 bit (4 octets, 8 nibbles) +