Editing hisilicon/kirin

{{hisil title|Kirin}}
{{ic family
| title             = Kirin
| image             = hisilicon kirin logo.svg
| caption           = Kirin Logo
| developer         = HiSilicon
| developer 2       = ARM Holdings
| manufacturer      = TSMC
| type              = System on chips
| first announced   = 2013
| first launched    = 2014
| arch              = Performance mobile ARM SoCs
| isa               = ARM
| microarch         = Cortex-A7
| microarch 2       = Cortex-A9
| microarch 3       = Cortex-A53
| microarch 4       = Cortex-A72
| microarch 5       = Cortex-A73
| word              = 32 bit
| word 2            = 64 bit
| proc              = 28 nm
| proc 2            = 16 nm
| proc 3            = 10 nm
| proc 4            = 7 nm
| tech              = CMOS
| clock min         = 1,200 MHz
| clock max         = 2,300 MHz
| package           = 
| package 2         = 
| package 3         = 

| succession       = Yes
| predecessor      = K3
| predecessor link = hisilicon/k3
| successor        = 
| successor link   = 
}}
'''Kirin''' is a family of {{arch|32}} and {{arch|64}} mobile [[ARM]] performance SoCs introduced by [[HiSilicon]] in [[2014]] as a successor to the {{\\|K3}} series.

== Overview ==
HiSilicon has always been the [[integrated circuit]] arm of [[Huawei]], developing various ICs and embedded [[microprocessors]] for their consumer electronics. It wasn't until [[2008]] with the introduction of the {{\\|K3}} family that [[HiSilicon]] started focusing on developing in-house high-performance microprocessors for the mobile market. In late [[2013]] HiSilicon introduced the Kirin family which featured their flagship high-performance mobile microprocessors found in their high-end phones and tablets.

Over the last couple of years, the Kirin family grew to include various mid-range performance models in addition to their high-end performance flagship processors. Latest models often utilize [[ARM Holdings|ARM]]'s latest cores fabricated on [[TSMC]]'s latest [[technology node]].

== Members ==

=== 600 Series ===
[[Kirin 620]]<br />

[[Kirin 650]]<br />

[[Kirin 655]]<br />

[[Kirin 658]]<br />

[[Kirin 659]]<br />

=== 700 Series ===
[[Kirin 710]] <br />
[[Kirin 710F]]

=== 800 Series ===
[[Kirin 810]] <br />
[[Kirin 820 5G]] <br />
[[Kirin 820E 5G]] <br />

=== 900 Series ===
[[Kirin 910]]<br />
[[Kirin 920]]<br />
[[Kirin 930]]<br />
[[Kirin 950]]<br />
[[Kirin 960]]<br />
[[Kirin 970]]<br />
[[Kirin 980]]<br />
[[Kirin 990 4G]]<br />
[[Kirin 990|Kirin 990 5G]]<br />
[[Kirin 990E 5G]]<br />
[[Kirin 9000 5G/4G]]<br />
[[Kirin 9000E]]<br />
designer	HiSilicon + and ARM Holdings +
first announced	2013 +
first launched	2014 +
full page name	hisilicon/kirin +
instance of	system on a chip family +
instruction set architecture	ARM +
main designer	HiSilicon +
manufacturer	TSMC +
microarchitecture	Cortex-A9 +, Cortex-A53 +, Cortex-A72 +, Cortex-A73 +, Cortex-A15 +, Cortex-A76 + and Cortex-A77 +
name	Kirin +
process	28 nm (0.028 μm, 2.8e-5 mm) +, 16 nm (0.016 μm, 1.6e-5 mm) +, 10 nm (0.01 μm, 1.0e-5 mm) +, 7 nm (0.007 μm, 7.0e-6 mm) +, 5 nm (0.005 μm, 5.0e-6 mm) +, 14 nm (0.014 μm, 1.4e-5 mm) + and 12 nm (0.012 μm, 1.2e-5 mm) +
technology	CMOS +
word size	32 bit (4 octets, 8 nibbles) + and 64 bit (8 octets, 16 nibbles) +