Editing qualcomm/snapdragon 800/855

{{qualcomm title|Snapdragon 855}}
{{chip
|name=Snapdragon 855
|image=sd 855 (front).png
|back image=sd 855 (back).png
|designer=Qualcomm
|designer 2=ARM Holdings
|manufacturer=TSMC
|model number=SDM855
|part number=SM8150
|market=Mobile
|first announced=December 4, 2018
|first launched=March, 2019
|family=Snapdragon 800
|series=800
|frequency=1,800 MHz
|frequency 2=2,420 MHz
|frequency 3=2,840 MHz
|isa=ARMv8
|isa family=ARM
|microarch=Cortex-A76
|microarch 2=Cortex-A55
|core name=Kryo 485 Gold
|core name 2=Kryo 485 Silver
|process=7 nm
|transistors=6,700,000,000
|technology=CMOS
|die area=73.27 mm²
|die length=8.48 mm
|die width=8.64 mm
|word size=64 bit
|core count=8
|thread count=8
|max memory=16 GiB
|max cpus=1
|predecessor=Snapdragon 845
|predecessor link=qualcomm/snapdragon 800/845
|successor=Snapdragon 865
|successor link=qualcomm/snapdragon_800/865
|contemporary=Snapdragon 855+
|contemporary link=qualcomm/snapdragon_800/855 plus
}}
[[File:snapdragon-855-block-diagram.png|thumb|right|Block Diagram|200px]]
'''Snapdragon 855''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2018]]. Fabricated on [[N7|TSMC 7nm process]], the 855 features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at 600 MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.

The Snapdragon 855 can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.

The {{\\|855 Plus}} is an identical, but higher clocked version of this processor.

== Clock domains ==
{{see also|7 nm lithography process#N7|l1=TSMC 7-nanometer (N7) process technology}}
The Snapdragon 855 utilizes TSMC [[N7|7-nanometer]] process. One of the major changes Qualcomm has done compared to the [[Snapdragon 845]] is on the physical implementation side. Whereas the Snapdragon 845 uses two clock domains in a standard [[DynamIQ]] cluster - one for the Silver cores and one for the Gold cores, the 855 uses three clock domains. One of the cores from the prior quad-core Gold clock domains has been moved to its own clock domain. Qualcomm refers to that core as a 'Prime' core. The Prime core utilizes TSMC high-performance cell (which uses a slightly relaxed 64 nm poly pitch) while the rest of the SoC utilizes TSMC standard high-density cells. The use of the high-performance [[standard cell|cells]] allows for the slightly higher frequency at similar power.


[[File:sdm855-clocks.svg|500px]]


Qualcomm reported that at the same power, Clock2 CPUs have improved by roughly 20% from the SDM845 to the SDM855. With the addition of Clock3, the four cores collectively extend this performance gain over the quad-core cluster on the 845 to over 30%.


[[File:855 clock improvement.png|550px]]

== Cache ==
{{main|arm_holdings/microarchitectures/cortex-a76#Memory_Hierarchy|arm_holdings/microarchitectures/cortex-a55#Memory_Hierarchy|l1=Cortex-A76 § Cache|l2=Cortex-A55 § Cache}}

Prime core {{armh|Cortex-A76|l=arch}}:
{{cache size
|l1 cache=128 KiB
|l1i cache=64 KiB
|l1i break=1x64 KiB
|l1i desc=4-way set associative
|l1d cache=64 KiB
|l1d break=1x64 KiB
|l1d desc=4-way set associative
|l2 cache=512 KiB
|l2 break=1x512 KiB
|l2 desc=8-way set associative
}}

3 core cluster {{armh|Cortex-A76|l=arch}}:
{{cache size
|l1 cache=384 KiB
|l1i cache=192 KiB
|l1i break=3x64 KiB
|l1i desc=4-way set associative
|l1d cache=192 KiB
|l1d break=3x64 KiB
|l1d desc=4-way set associative
|l2 cache=768 KiB
|l2 break=3x256 KiB
|l2 desc=8-way set associative
}}

Quad-core cluster {{armh|Cortex-A55|l=arch}}:
{{cache size
|l1 cache=512 KiB
|l1i cache=256 KiB
|l1i break=4x64 KiB
|l1i desc=2-way set associative
|l1d cache=256 KiB
|l1d break=4x64 KiB
|l1d desc=4-way set associative
|l2 cache=512 KiB
|l2 break=4x128 KiB
|l2 desc=8-way set associative
}}

* 2 MiB L3

== Memory controller ==
{{memory controller
|type=LPDDR4X-4266
|ecc=No
|max mem=16 GiB
|controllers=1
|channels=4
|width=16 bit
|max bandwidth=31.79 GiB/s
|frequency=2133 MHz
|bandwidth schan=7.95 GiB/s
|bandwidth dchan=15.89 GiB/s
|bandwidth qchan=31.79 GiB/s
}}

== DSP ==
{{#set: dsp|Hexagon 690 DSP}}
This chip features [[Qualcomm]]'s {{qualcomm|Hexagon}} {{qualcomm|Hexagon 690|690}} DSP.

== Graphics ==
{{integrated graphics
| gpu                 = Adreno 640 GPU
| designer            = Qualcomm
| execution units     = 
| max displays        = 2
| max memory          = 
| frequency           = 250 MHz
| max frequency       = 600 MHz

| output crt          = 
| output sdvo         = 
| output dsi          = 
| output edp          = 
| output dp           = 
| output hdmi         = 
| output vga          = 
| output dvi          = 

| directx ver        = 12
| opengl ver         = 
| opengl es ver      = 3.2
| opencl ver         = 2.0
| vulkan ver         = 1.1
| hdmi ver           = 
| dp ver             = 
| edp ver            = 
| max res hdmi       = 
| max res hdmi freq  = 
| max res dp         = 
| max res dp freq    = 
| max res edp        = 
| max res edp freq   = 
| max res vga        = 
| max res vga freq   = 
}}

* Codec: H.265 (HEVC), H.264 (AVC), HDR10, HDR10+, HLG, VP8, VP9
* HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision
* Volumetric VR video playback
* 8K 360 VR video playback

== Camera ==
* ISP
** Qualcomm Spectra 380 image signal processor
*** Dual 14-bit CV-ISPs
*** Hardware accelerator for computer vision (CV-ISP)
** Up to 20 MP dual camera
** Up to 48 MP single camera

* Photo Capture: HEIF photo capture
* Video Capture:
** Rec. 2020 color gamut video capture
** Up to 10-bit color depth video capture
** Slow motion video capture up to 720p at 480fps,HEVC Video Capture

== Connectivity ==
* X24 LTE modem
** LTE Category 20
** Downlink:
*** 2 Gbps peak
*** 7x20 MHz carrier aggregation
*** Up to 256-QAM
*** Up to 4x4 MIMO on five carriers
*** Full-Dimension MIMO (FD-MIMO)
*** Maximum 20 spatial streams
** Uplink: 
*** 316 Mbps peak
*** 3x20 MHz carrier aggregation
*** Up to 2x 106Mbps LTE streams
*** Up to 256-QAM
*** Uplink data compression
* LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

* WiFi
** Standards: 802.11ax, 802.11ac Wave 2, 802.11a/b/g, 802.11n
** Spectral Bands: 2.4 GHz, 5 GHz, 6 GHz

* Bluetooth
** Bluetooth 5.0
** 2 Mbps

== Location ==
* Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, Dual frequency GNSS

== Utilizing devices ==
* [[used by::Asus RoG Phone 2]]
* [[used by::Asus Zenfone 6Z]]
* [[used by::Blackshark 2 SKywalker]]
* [[used by::Galaxy Note 10]]
* [[used by::Google Pixel 4]]
* [[used by::Lenovo Z5 Pro GT]]
* [[used by::Lenovo Z6 Pro]]
* [[used by::LG G8 ThinQ]]
* [[used by::LG G8s ThinQ]]
* [[used by::LG V50 ThinQ]]
* [[used by::OnePlus 7]]
* [[used by::OnePlus 7 Pro]]
* [[used by::OPPO Reno]]
* [[used by::Samsung Galaxy Tab S6]]
* [[used by::Samsung Galaxy S10+]]
* [[used by::Samsung Galaxy S10]]
* [[used by::Samsung Galaxy S10e]]
* [[used by::Sony Xperia 1]]
* [[used by::Sony Xperia 5]]
* [[used by::Xiaomi Mi 9]]
* [[used by::Xiaomi Mi 9T Pro]]
* [[used by::Redmi K20 Pro]]
* [[used by::Xiaomi Mi MIX 3 5G Edition]]
* [[used by::Xiaomi Redmi K20 Pro]]
* [[used by::ZTE Axon 10 Pro]]
* [[used by::ZTE Nubia Red Magic 3]]

{{expand list}}

== Documents ==
* [[:File:snapdragon-855-mobile-platform-product-brief.pdf|Product Brief]]
* [[:File:snapdragon-855-entertainment-deep-dive-hiren-bhinde.pdf|Entertainment Deep Dive Presentation]]
* [[:File:snapdragon-855-deep-dives-intro-keith-kressin.pdf|Deep Dive Presentation]]

== Bibliography ==
* {{bib|vlsi|2019|Qualcomm, TSMC}}
* Techinsights ''[https://www.techinsights.com/about-techinsights/overview/blog/Lenovo-Brings-the-New-Snapdragon-to-Market/ "Lenovo Brings the New Snapdragon to Market"]''
* WikiChip Fuse ''[https://fuse.wikichip.org/news/2408/tsmc-7nm-hd-and-hp-cells-2nd-gen-7nm-and-the-snapdragon-855-dtco/ "TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO"]''
back image	+
base frequency	1,800 MHz (1.8 GHz, 1,800,000 kHz) +, 2,420 MHz (2.42 GHz, 2,420,000 kHz) + and 2,840 MHz (2.84 GHz, 2,840,000 kHz) +
core count	8 +
core name	Kryo 485 Gold + and Kryo 485 Silver +
designer	ARM Holdings + and Qualcomm +
die area	73.27 mm² (0.114 in², 0.733 cm², 73,270,000 µm²) +
die length	8.48 mm (0.848 cm, 0.334 in, 8,480 µm) +
die width	8.64 mm (0.864 cm, 0.34 in, 8,640 µm) +
dsp	Hexagon 690 DSP +
family	Snapdragon 800 +
first announced	December 4, 2018 +
first launched	March 2019 +
full page name	qualcomm/snapdragon 800/855 +
has ecc memory support	false +
instance of	microprocessor +
integrated gpu	Adreno 640 GPU +
integrated gpu base frequency	257 MHz (0.257 GHz, 257,000 KHz) +
integrated gpu designer	Qualcomm +
integrated gpu max frequency	585 MHz (0.585 GHz, 585,000 KHz) +
isa	ARMv8 +
isa family	ARM +
l1$ size	128 KiB (131,072 B, 0.125 MiB) +, 384 KiB (393,216 B, 0.375 MiB) + and 512 KiB (524,288 B, 0.5 MiB) +
l1d$ description	4-way set associative +
l1d$ size	64 KiB (65,536 B, 0.0625 MiB) +, 192 KiB (196,608 B, 0.188 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l1i$ description	2-way set associative + and 4-way set associative +
l1i$ size	64 KiB (65,536 B, 0.0625 MiB) +, 192 KiB (196,608 B, 0.188 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l2$ description	8-way set associative +
l2$ size	0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) + and 0.75 MiB (768 KiB, 786,432 B, 7.324219e-4 GiB) +
ldate	March 2019 +
main image	+
manufacturer	TSMC +
market segment	Mobile +
max cpu count	1 +
max memory	16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth	31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels	4 +
microarchitecture	Cortex-A55 + and Cortex-A76 +
model number	SDM855 +
name	Qualcomm Snapdragon 855 +
part number	SM8150 +
process	7 nm (0.007 μm, 7.0e-6 mm) +
series	800 +
smp max ways	1 +
supported memory type	LPDDR4X-4266 +
technology	CMOS +
thread count	8 +
transistor count	6,700,000,000 +
used by	Asus ROG Phone 2 +, Asus Zenfone 6 +, Asus Zenfone 6Z +, Blackshark 2 SKywalker +, Google Pixel 4/XL +, LG G8 ThinQ +, LG G8S ThinQ +, LG G8X ThinQ +, LG V50 ThinQ +, LG V50S ThinQ +, Lenovo Z5 Pro GT +, Lenovo Z6 Pro +, Meizu 16s +, Microsoft Surface Duo +, OPPO Reno 10x Zoom +, OnePlus 7 +, OnePlus 7 Pro +, OnePlus 7T +, OnePlus 7T Pro +, Oppo Reno 10x Zoom +, Realme X2 PRO +, Samsung Galaxy A90 5G +, Samsung Galaxy Fold +, Samsung Galaxy Note 10 +, Samsung Galaxy Note 10+ +, Samsung Galaxy S10 +, Samsung Galaxy S10 5G +, Samsung Galaxy S10 Lite +, Samsung Galaxy S10+ +, Samsung Galaxy S10e +, Samsung Galaxy Tab S6 +, Sharp Aquos R3 +, Sony Xperia 1 +, Sony Xperia 5 +, VIVO IQOO +, Xiaomi Mi 9 +, Xiaomi Mi 9T Pro +, Xiaomi Mi MIX 3 5G Edition +, Xiaomi Poco X3 Pro +, Xiaomi Redmi K20 Pro +, ZTE Axon 10 Pro + and ZTE Nubia Red Magic 3 +
word size	64 bit (8 octets, 16 nibbles) +