Editing intel/cores/kaby lake g

{{intel title|Kaby Lake G|core}}
{{core
|name=Kaby Lake G
|image=kaby lake g (front).png
|caption=Package front
|developer=Intel
|developer 2=AMD
|manufacturer=Intel
|manufacturer 2=GlobalFoundries
|first announced=November 6, 2017
|first launched=January 7, 2018
|isa=x86-64
|isa family=x86
|microarch=Kaby Lake
|word=64 bit
|proc=14 nm
|tech=CMOS
}}
'''Kaby Lake G''' ('''KBL-G''') is the name of the core for [[Intel]]'s high-performance line of mobile processors based on the {{intel|Kaby Lake|l=arch}} microarchitecture and incorporate a discrete [[AMD]] {{amd|Vega|l=arch}} graphics processor. These chips are targeted towards ultimate mobile gaming experience. Kaby Lake G processors are fabricated on Intel's enhanced [[14 nm lithography process|14nm+ process]] and for graphics, GlobalFoundries [[14 nm process]].


{{future information}}


== Overview ==
[[File:8th gen core i7 with radeon logo (2018).png|250px|right]]
[[File:8th gen core i5 with radeon logo (2018).png|250px|right]]
Kaby Lake G based processors are a 2-chip solution - the [[microprocessor]] and the [[chipset]]. Those parts are [[BGA]] and are soldered onto the motherboard. The microprocessor is connected to the chipset via 4 of the chip's 20 PCIe lanes using Intel's proprietary {{intel|Direct Media Interface}} 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane.

=== Graphics ===
Those processors are unique in the fact that this is the first time Intel has integrated a discrete graphics processor into the same package as the microprocessor. This is also the first time they are using a competitor graphics processor. Those parts incorporate an [[AMD]] [[GPU]] based on the {{amd|Vega|l=arch}} microarchitecture and incorporate their own 4 GiB of [[high-bandwidth memory]] 2 (HBM2). The HBM solution is connected to the graphics processor using Intel's [[EMIB]], a high-speed in-package interconnect solution.

The CPU itself is connected to the GPU using 8 of the other PCIe lanes, leaving the 8 remaining lanes for other peripherals to communicate with the CPU directly.


[[File:kaby lake g with amd radeon package.png|600px]]


=== Common Features ===
All Kaby Lake G processors have the following:

* Dual-channel Memory
** Up to DDR3L-1600, DDR4-2400
** Up to 64 GiB
* 8x PCIe
** 20x in total, 4 of the 20 are used by the bus and 8 for the GPU as described above
* [[quad-core]] with {{intel|Hyper-Threading}} (8 threads)
* Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, and AVX2)

=== Graphics ===
Those processors have superior graphics capabilities as well as 4 GiB of [[HBM 2]] cache.

* [[HBM 2]]
** 4 GiB
** 1,024 bit
*** @ 800 MHz (204.8 GB/s peak bandwidth)
*** @ 700 MHz (179.2 GB/s peak bandwidth)
* Graphics
** Integrated {{intel|HD Graphics 630}} ({{intel|Gen9.5|l=arch}} GT2)
*** Base frequency of 350 MHz
*** Burst frequency of 1.1 GHz
** Discrete {{amd|Vega|l=arch}}-based GPUs
*** Custom Radeon RX Vega M Graphics
**** [[Radeon RX Vega M GH]]
***** 24 Compute Units
***** 1,536 Stream processors, 64 pix/clk
***** 3.7 TFLOPS peak performance
**** [[Radeon RX Vega M GL]]
***** 20 Compute Units
***** 1280 Stream processors, 32 pix/clk
***** 2.6 TFLOPS peak performance
* BGA package

{{clear}}

== Kaby Lake G Processors ==
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{{comp table start}}
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{{comp table header|main|11:List of Kaby Lake G-based Processors}}
{{comp table header|main|7:Main processor|3:Graphics Processors|1:Features}}
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{{comp table count|ask=[[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[core name::Kaby Lake G]]}}
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{{comp table end}}

== See also ==
{{intel kaby lake core see also}}
designer	Intel + and AMD +
first announced	November 6, 2017 +
first launched	January 7, 2018 +
instance of	core +
isa	x86-64 +
isa family	x86 +
main image	+
main image caption	Package front +
manufacturer	Intel + and GlobalFoundries +
microarchitecture	Kaby Lake +
name	Kaby Lake G +
process	14 nm (0.014 μm, 1.4e-5 mm) +
technology	CMOS +
word size	64 bit (8 octets, 16 nibbles) +