Editing mediatek/helio/p30

{{mediatek title|Helio P30}}
{{mpu
|future=Yes
|name=Helio P30
|no image=No
|designer=MediaTek
|designer 2=ARM Holdings
|manufacturer=TSMC
|model number=P30
|market=Mobile
|first announced=August 28, 2017
|family=Helio
|series=Helio P
|frequency=1,650 MHz
|frequency 2=2,300 MHz
|isa=ARMv8
|isa family=ARM
|microarch=Cortex-A53
|core name=Cortex-A53
|process=16 nm
|technology=CMOS
|word size=64 bit
|core count=8
|thread count=8
|max cpus=1
|max memory=6 GiB
}}
'''Helio P30''' is a mid-range performance {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] set to launch in late [[2017]]. This SoC, which is fabricated on [[TSMC]]'s [[16 nm process]], incorporates eight {{armh|Cortex-A53|l=arch}} cores with four [[little cores]] operating at up to 1.65 GHz and four [[big cores]] operating at up to 2.3 GHz. The Helio P30 supports up to 6 GiB of dual-channel LPDDR4X-3200 memory and incorporates a modem supporting [[LTE]] User Equipment (UE) category 7 (DL)/13 (UL).


{{unknown features}}
base frequency	1,650 MHz (1.65 GHz, 1,650,000 kHz) + and 2,300 MHz (2.3 GHz, 2,300,000 kHz) +
core count	8 +
core name	Cortex-A53 +
designer	MediaTek + and ARM Holdings +
family	Helio +
first announced	August 28, 2017 +
first launched	August 28, 2017 +
full page name	mediatek/helio/p30 +
has 4g support	true +
has e-utran support	true +
has ecc memory support	false +
has lte advanced support	true +
instance of	microprocessor +
integrated gpu	Mali-G71 +
integrated gpu base frequency	950 MHz (0.95 GHz, 950,000 KHz) +
integrated gpu designer	ARM Holdings +
integrated gpu execution units	2 +
isa	ARMv8 +
isa family	ARM +
ldate	August 28, 2017 +
main image	+
manufacturer	TSMC +
market segment	Mobile +
max cpu count	1 +
max memory	6,144 MiB (6,291,456 KiB, 6,442,450,944 B, 6 GiB, 0.00586 TiB) +
max memory bandwidth	11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels	2 +
microarchitecture	Cortex-A53 +
model number	P30 +
name	Helio P30 +
process	16 nm (0.016 μm, 1.6e-5 mm) +
series	Helio P +
smp max ways	1 +
supported memory type	LPDDR4X-3200 +
technology	CMOS +
thread count	8 +
user equipment category	7 (DL), 13 (UL) +
word size	64 bit (8 octets, 16 nibbles) +