Editing 240 nm lithography process

{{lithography processes}}
The '''240 nm lithography process''' is was semiconductor manufacturing process following the [[350 nm lithography process|350 nm process]]. Commercial [[integrated circuit]] manufacturing using 240 process began in late 1990s. 240 nm and was phased out and later replaced by [[220 nm]] and [[180 nm]] processes.

== Industry ==
{{scrolling table/top|style=text-align: right; | first=Fab
 |Process Name
 |1st Production
 |Contacted Gate Pitch
 |Interconnect Pitch (M1P)
 |Metal Layers
 |SRAM bit cell
}}
{{scrolling table/mid}}
|-
! [[Fujitsu]]
|- style="text-align: center;"
| CS-70
|-
| 1997
|- 
| ? nm
|-
| ? nm
|-
| ?
|-
| ? µm<sup>2</sup>
{{scrolling table/end}}

== 240 nm Microprocessors ==
* HAL (Fujitsu)
** {{hal|SPARC64 GP}}
{{expand list}}