Editing amd/packages/fp3

{{amd title|Package FP3}}
{{package
|name=Package FP3
|designer=AMD
|market=Mobile
|market 2=Embedded
|first launched=June 2014
|microarch=Steamroller
|tdp=35 W
|package name=BGA-854
|package type=Organic Micro Ball Grid Array
|package contacts=854
|package dimension=29 mm
|package dimension 2=32 mm
|package pitch=0.8 mm
}}

'''FP3''' is a BGA-854 package for [[AMD]] mobile and embedded microprocessors with integrated graphics. Its counterpart for desktop processors is the PGA-906 package for {{\\|Socket FM2+}}. FP3 is the successor to the {{\\|FP2}} package and was superseded by the {{\\|FP4}} package.

All processors in the FP3 package are members of AMD's Family 15h with CPU cores based on the {{amd|Steamroller|l=arch}} microarchitecture, and are fabricated on a 28 nm SOI process.


=== Features ===
* 854-pin lidless micro ball grid array package, 0.8-1.2 mm multi-pitch, 29 × 32 mm, organic substrate

* 2 × 64/72 bit DDR3 SDRAM interface up to 1067 MHz, PC3-17000 (DDR3-2133), 34.1 GB/s
** Up to 2 SR/DR UDIMMs or SODIMMs (1 per channel), ECC supported
** JEDEC 1.5V, 1.35V, 1.25V
** AMD Memory Controller PowerCap

* PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
** Configurable x16 external graphics card (GFX) link (x16, x8, x4, up to 2 ports, DDI)
* PCIe Gen 1.0, 2.0 (5 GT/s)
** Configurable x8 General Purpose Ports (x4, x2, x1, up to 5 ports, DDI)
** x4 Unified Media Interface to FCH

* Four independent display controllers
** Seven Digital Display Interfaces
*** 3 × single link, dual link DVI by combining DP1:DP0
*** 3 × multiplexed with 1x4 (dual link DVI 1x8) GFX lanes
*** 1 × multiplexed with GPP lanes 7:4
** DisplayPort 1.2 up to 3840 × 2160 at 30 Hz and 24 bpp, HDCP 1.1, DP++, DP audio
** eDP 1.3 up to 1920 × 1080 at 60 Hz and 30 bpp
** Single/dual link DVI up to 2560 × 1600 at 60 Hz and 30 bpp
** HDMI 1.3 up to 4096 × 2160 at 24 Hz and 24 bpp, HDCP 1.3
** VGA via FCH DP-DAC

* Power Management
** AMD PowerNow! technology
** ACPI P-states, processor power states C0, C1, CC6, PC6, sleep states S0, S3, S4, S5
** PCIe power gating
** PCIe speed power policy
** SmartSleep
** AMD Turbo CORE technology with per-core power gating
** Dynamic panel refresh rate, panel self-refresh

* Thermal Controls
** Sideband temperature control
** Hardware thermal control
** DRAM thermal protection

== Chipsets ==
* AMD FCH A76M, codename "Bolton-M3"
* AMD FCH A77E, codename "Bolton-E4"

== Processors using package FP3 ==
* AMD A-Series APU, codename "Kaveri"
* AMD Embedded R-Series APU "Bald Eagle"
<!-- Mentioned only in AMD #51603.
* AMD Opteron X1200 Series Processor
* AMD Opteron X2200 Series APU
-->

<!-- NOTE:
           This table is generated automatically from the data in the actual articles.
           If a microprocessor is missing from the list, an appropriate article for it needs to be
           created and tagged accordingly.

           Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
-->
{{comp table start}}
<table class="comptable sortable tc13 tc14 tc15 tc16 tc17 tc18 tc19">
<tr class="comptable-header"><th>&nbsp;</th><th colspan="19">List of all FP3-based Processors</th></tr>
{{comp table header 1|cols=Price, Process, Launched, µarch, Family, Core, C, T, Freq, Turbo, TDP}}
{{#ask: [[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::FP3]]
 |?full page name
 |?model number
 |?release price
 |?process
 |?first launched
 |?microarchitecture
 |?microprocessor family
 |?core name
 |?core count
 |?thread count
 |?base frequency#GHz
 |?turbo frequency (1 core)#GHz
 |?tdp
 |format=template
 |template=proc table 3
 |userparam=13
 |mainlabel=-
}}
{{comp table count|ask=[[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::FP3]]}}
</table>
{{comp table end}}

== Package Diagram ==
:[[File:BGA-854 diag.svg]]

Approximate dimensions of the Kaveri package. All dimensions in millimeters.

:[[File:BGA-854 pn.svg|800px]]

FP3 package ball numbers.

== Pin Map ==
:[[File:BGA-854 pinmap.svg|800px]]

== References ==
* "BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 15h Models 30h-3Fh Processors", AMD Publ. #49125, Rev. 3.06, February 12, 2015
* "Revision Guide for AMD Family 15h Models 30h-3Fh Processors", AMD Publ. #51603, Rev. 1.06, April 21, 2014
* "Product Brief: 2nd Generation AMD Embedded R-Series APU", PID 1726406-A, 2017
* "White Paper: Small Form Factor Board Designs", AMD Publ. #54507, Rev. A

== See also ==
* {{\\|FP2|Package FP2}}
* {{\\|FP4|Package FP4}}
* {{\\|Socket FM2+}}

[[Category:amd]]
designer	AMD +
first launched	June 2014 +
instance of	package +
market segment	Mobile + and Embedded +
microarchitecture	Steamroller +
name	Package FP3 +
package	BGA-854 + and FP3 +
package contacts	854 +
package length	29 mm (2.9 cm, 1.142 in) +
package pitch	0.8 mm (0.0315 in) +
package type	Organic Micro Ball Grid Array +
package width	32 mm (3.2 cm, 1.26 in) +
tdp	35 W (35,000 mW, 0.0469 hp, 0.035 kW) +