Semiconductor & Computer Engineering
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Information for "amd/packages/fp6"
Basic information
| Display title | Package FP6 - AMD |
| Default sort key | Package FP6, AMD |
| Page length (in bytes) | 20,312 |
| Page ID | 36335 |
| Page content language | English (en) |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| Number of subpages of this page | 0 (0 redirects; 0 non-redirects) |
Page protection
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
Edit history
| Page creator | QuietRub (talk | contribs) |
| Date of page creation | 03:53, 2 January 2021 |
| Latest editor | QuietRub (talk | contribs) |
| Date of latest edit | 17:47, 10 May 2023 |
| Total number of edits | 6 |
| Total number of distinct authors | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Page properties
| Transcluded templates (18) | Templates used on this page:
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Facts about "Package FP6 - AMD"
| designer | AMD + |
| first launched | March 16, 2020 + |
| instance of | package + |
| market segment | Mobile + and Embedded + |
| microarchitecture | Zen 2 + and Zen 3 + |
| name | Package FP6 + |
| package | FP6 + |
| package contacts | 1,140 + |
| package height | 1.38 mm (0.0543 in) + |
| package length | 35 mm (3.5 cm, 1.378 in) + |
| package pitch | 0.65 mm (0.0256 in) + |
| package type | FC-OBGA + |
| package width | 25 mm (2.5 cm, 0.984 in) + |
| tdp | 55 W (55,000 mW, 0.0738 hp, 0.055 kW) + |
