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  • ...oarchitecture ultimately determines its capabilities with respect to those design goals. {{main|IC design flow}}
    3 KB (431 words) - 22:51, 21 November 2017
  • ...ing.</ref> || GT Stepping<ref group=devID>The GT Stepping refers to the GT design stepping.</ref> || Device2 ID<ref group=devID>The Device2 ID is the PCI dev The '''Command Stream''' ('''CS''') unit manages the the flow of execution for the FF Pipeline (3D Pipeline) and the Media pipelines. The
    29 KB (3,752 words) - 13:14, 19 April 2023
  • ...ing.</ref> || GT Stepping<ref group=devID>The GT Stepping refers to the GT design stepping.</ref> || Device2 ID<ref group=devID>The Device2 ID is the PCI dev The '''Command Stream''' ('''CS''') unit manages the the flow of execution for the FF Pipeline (3D Pipeline) and the Media pipelines. The
    33 KB (4,255 words) - 17:41, 1 November 2018
  • {{ic family The P1 series are designed for low-power fan-less design designed to succeed previous models (e.g., PowerQUICC II Pro) with higher p
    6 KB (795 words) - 20:23, 31 October 2017
  • ...ng and simulating [[digital circuits]]. It is used in early front-end [[IC design]]. ...means that all of Verilog code can be run in SystemVerilog simulators and design tools. Only thing that SV added is better Verification methodology like UVM
    4 KB (633 words) - 09:23, 27 March 2018
  • * [[3D IC|3D]] [[die stacking]] ...robe at the receiving end. Each lane has a 16 [[FLIT]] queue, arbiter, and flow control logic. The router is implemented using a 5-stage pipeline with a tw
    16 KB (2,552 words) - 23:22, 17 May 2019
  • ...('''CoWoS''') is a [[two-point-five dimensional integrated circuit]] (2.5D IC) [[through-silicon via]] (TSV) [[interposer]]-based packaging technology de ...d very good PDN improvements with iCAP. Compared to equivalent CoWoS-based design without iCAP, TSMC is reporting just 0.05x the impedance and 0.45x the volt
    6 KB (943 words) - 23:31, 1 August 2021