...eld''' ('''LKF''') is a high-performance low-power [[3d integrated circuit|3D]] microarchitecture designed by Intel and introduced in [[2019]]. * [[3D integrated circuit]]

'''Foveros''' is a high-performance [[three-dimensional integrated circuit]] (3D IC) face-to-face-based packaging technology designed by [[Intel]]. First introduced in 2019, Foveros is an advanced 3D face-to-face die stacking packaging process technology. The technology is d

...5 PCnet™-FAST I I I Single-Chip 10/100 Mbps PCI Ethernet Controller with Integrated PHY]||2000-07-31|| ...m/system/files/TechDocs/23111.pdf Am186CC Microcontroller Power Management Circuit Application Note]||1999-11-01||