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Difference between revisions of "intel/mobile pentium ii/300"
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{{intel title|Mobile Pentium II 300}}
 
{{intel title|Mobile Pentium II 300}}
{{mpu
+
{{chip
 
| name                = Mobile Pentium II 300
 
| name                = Mobile Pentium II 300
 
| no image            = Yes
 
| no image            = Yes
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| model number        = 300
 
| model number        = 300
 
| part number        = 80523TX300512
 
| part number        = 80523TX300512
| part number 1       = PMD30005002AA
+
| part number 2       = PMD30005002AA
| part number 2       = PME30005002AA
+
| part number 3       = PME30005002AA
| part number 3       = PME30005001AA
+
| part number 4       = PME30005001AA
 
| market              = Mobile
 
| market              = Mobile
 
| first announced    = 1998
 
| first announced    = 1998
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| max memory          = 64 GiB
 
| max memory          = 64 GiB
  
| electrical          = Yes
+
 
 
| power              =  
 
| power              =  
 
| v core              = 1.6
 
| v core              = 1.6
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== Features ==
 
== Features ==
{{mpu features
+
{{x86 features
 
| mmx        = Yes
 
| mmx        = Yes
 
}}
 
}}

Latest revision as of 16:25, 13 December 2017

Edit Values
Mobile Pentium II 300
General Info
DesignerIntel
ManufacturerIntel
Model Number300
Part Number80523TX300512,
PMD30005002AA,
PME30005002AA,
PME30005001AA
S-SpecSL2RS, SL2Y7
MarketMobile
Introduction1998 (announced)
September 9, 1998 (launched)
ShopAmazon
General Specs
FamilyMobile Pentium II
LockedYes
Frequency300 MHz
Bus typeFSB
Bus speed66 MHz
Clock multiplier4.5
CPUID0652h
Microarchitecture
MicroarchitectureP6
Core NameTonga
Core Family6
Core Model5
Core SteppingmdA0, mdB0, mdB0
Process250 nm
Transistors7,500,000
TechnologyCMOS
Die131 mm²
Word Size32 bit
Cores1
Threads1
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore1.6 ± 0.12 V
TDP11.1 W
OP Temperature-40 °C – 85 °C

The Mobile Pentium II 300 was a 32-bit x86 microprocessor, part of the first batch from the Mobile Pentium II family. This MPU operated at 300 MHz and had a TDP of 11.1 Watts. This chip was manufactured in 250 nm process and included a larger 512 KB of L2$ on package, but on a separate die.

Cache[edit]

Main article: P6 § Cache
Cache Info [Edit Values]
L1I$ 16 KiB
16,384 B
0.0156 MiB
1x16 KiB 4-way set associative
L1D$ 16 KiB
16,384 B
0.0156 MiB
1x16 KiB 4-way set associative
L2$ 512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
1x512 KiB 4-way set associative (separate die, same package)

Graphics[edit]

This processor has no integrated graphics processing unit.

Memory controller[edit]

This processor has no integrated memory controller.

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
l1d$ description4-way set associative +
l1d$ size16 KiB (16,384 B, 0.0156 MiB) +
l1i$ description4-way set associative +
l1i$ size16 KiB (16,384 B, 0.0156 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +