From WikiChip
Editing intel/foveros
Warning: You are not logged in. Your IP address will be publicly visible if you make any edits. If you log in or create an account, your edits will be attributed to your username, along with other benefits.
The edit can be undone.
Please check the comparison below to verify that this is what you want to do, and then save the changes below to finish undoing the edit.
This page supports semantic in-text annotations (e.g. "[[Is specified as::World Heritage Site]]") to build structured and queryable content provided by Semantic MediaWiki. For a comprehensive description on how to use annotations or the #ask parser function, please have a look at the getting started, in-text annotation, or inline queries help pages.
Latest revision | Your text | ||
Line 13: | Line 13: | ||
− | The key feature of Foveros is the face-to-face (F2F) chip-on-chip bonding through extremely | + | The key feature of Foveros is the face-to-face (F2F) chip-on-chip bonding through extremely fin-pitched, 36-micron, microbumps (mostly likely copper pillars). F2F flow is somewhat fairly straightforward. Bumping is done to the base and top dies followed by backgrinding and then singulation. They likely use TCB-NCP for the final assembly, but this is pure speculation. The main benefits of F2F are the interconnect density scaling and lower wire parasitics which is important of high-performance applications like those used by Intel. It’s important to note that Foveros was not designed to replace EMIB, it compliments it. The two technologies solve slightly different problems. In fact, the two technologies may even be combined to form even more complex products. It’s possible to have a combination of existing 2.5D and 3D with something like [[HBM]] and Foveros stacked dies. |
Line 33: | Line 33: | ||
{{main|intel/microarchitectures/lakefield|l1=Lakefield Microarchitecture}} | {{main|intel/microarchitectures/lakefield|l1=Lakefield Microarchitecture}} | ||
Intel's first Foveros-based product is {{intel|Lakefield|l=arch}}. | Intel's first Foveros-based product is {{intel|Lakefield|l=arch}}. | ||
− | |||
− | |||
− | |||
== Bibliography == | == Bibliography == | ||
* Intel 2018 Architecture Day. | * Intel 2018 Architecture Day. | ||
* Intel. ''personal communication''. 2019. | * Intel. ''personal communication''. 2019. |