Editing hisilicon/kunpeng

{{hisilicon title|Kunpeng (Hi16xx)}}
{{ic family
| title             = Kunpeng
| image             = hi1616 (front).png
| caption           = Hi1616 Chip
| developer         = HiSilicon
| developer 2       = ARM Holdings
| developer 3       = 
| manufacturer      = TSMC
| manufacturer 2    = 
| type              = System on chips
| first announced   = 2014
| first launched    = 
| arch              = 
| isa               = ARM
| microarch         = 
| microarch 2       = 
| microarch 3       = 
| word              = 64 bit
| proc              = 
| proc 2            = 
| proc 3            = 
| tech              = CMOS
| clock             = 
| clock min         = 
| clock max         = 
| package           = 
| package 2         = 
| socket            = 
| socket 2          = 
}}
'''Kunpeng''' ('''Hi16xx''') is a family of {{arch|64}} [[ARM]] multi-core server SoCs designed for [[Huawei]] line of enterprise ARM servers.

== Overview ==
[[File:kunpeng roadmap (2019).jpeg|right|thumb|Roadmap]]
Kunpeng, also known as Hi16xx, is a series of {{arch|64}} [[ARM]] server microprocessors designed by [[Huawei]]. First introduced in 2015, those processors are geared towards highly-threaded or high-throughput applications. Those processors were only found in the HiSilicon evaluation development boards and in a few limited series of Huawei servers. Huawei expanded their server offerings in 2018 and 2019 with the TaiShan line of servers. In early 2019, with the introduction of the 920 series, Huawei rebranded the series as the Kunpeng.

=== Naming scheme ===
:[[File:huawei kunpeng naming scheme.svg|600px]]

== Models ==
=== Older models ===
Older models were based on [[Arm's]] mobile [[Cortex]] cores. Those models range from [[16 cores|16]] to [[32 cores]] and offer up to four memory channels.
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           This table is generated automatically from the data in the actual articles.
           If a microprocessor is missing from the list, an appropriate article for it needs to be
           created and tagged accordingly.

           Missing a chip? please dump its name here: https://en.wikichip.org/wiki/WikiChip:wanted_chips
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{{comp table start}}
<table class="comptable sortable tc4">
{{comp table header|main|5:List of Older Hi16xx Processors}}
{{comp table header|main|5:Main processor}}
{{comp table header|cols|Launched|Cores|Arch|%Frequency|L3}}
{{#ask: [[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[first launched::< 2018]]
 |?full page name
 |?model number
 |?first launched
 |?core count
 |?core name
 |?base frequency#GHz
 |?l3$ size
 |format=template
 |template=proc table 3
 |userparam=7
 |mainlabel=-
}}
{{comp table count|ask=[[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[first launched::< 2018]]}}
</table>
{{comp table end}}
=== 920 Series ===
{{see also|hisilicon/microarchitectures/taishan v110|l1=Taishan v110 microarchitecture}}
[[File:hi1620 exhibit sign.jpg|right|thumb|Hi1620 on exhibit.]]
In late 2018, Huawei announced the Kunpeng 920 series, also known as the Hi1620. Manufactured on [[TSMC]]'s [[7 nm process]], those processors are based on the company's custom-designed {{hisilicon|Taishan v110|l=arch}} ARMv 8.2 cores operating at up to 2.6 GHz. All models support up to eight channels of DDR4 memory and up to four-way SMP.

* '''Proc:''' [[7 nm process]]
* '''ISA:''' [[ARMv8.2]]
* '''TDP:''' 100 W - 200 W
* '''Mem:''' Octa-channel DDR4-2933 memory
* '''I/O:''' x40 PCIe Gen 4 with [[CCIX]] support, 2x 100GbE, RoCEv2, 4x USB 3.0, x16 SAS 3.0, 2x SATA 3.0 
<!-- NOTE: 
           This table is generated automatically from the data in the actual articles.
           If a microprocessor is missing from the list, an appropriate article for it needs to be
           created and tagged accordingly.

           Missing a chip? please dump its name here: https://en.wikichip.org/wiki/WikiChip:wanted_chips
-->
{{comp table start}}
<table class="comptable sortable tc4">
{{comp table header|main|6:List of Hi1620 Processors}}
{{comp table header|cols|Launched|Cores|Arch|%Frequency|L3|TDP}}
{{#ask: [[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[series::920]]
 |?full page name
 |?model number
 |?first launched
 |?core count
 |?core name
 |?base frequency#GHz
 |?l3$ size
 |?tdp
 |format=template
 |template=proc table 3
 |userparam=8
 |mainlabel=-
}}
{{comp table count|ask=[[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[series::920]]}}
</table>
{{comp table end}}

== See also ==
* Cavium's {{cavium|ThunderX2}}
* Qualcomm's {{qualcomm|Centriq}}
* Intel's {{intel|Xeon Scalable}}
@@ Line 108: / Line 108: @@
 </table>
 {{comp table end}}
-=== 930 Series ===
-[[File:hislicon kunpeng roadmap to 930.png|thumb|right|Kunpeng 930 Roadmap]]
-Next-generation SoCs are the Hi1630 which are branded as Kunpeng 930 series. Those chips are expected to feature a higher-performance core with higher frequencies, simultaneous multithreading support, and Arm’s {{arm|Scalable Vector Extension}} (SVE) extension. Those chips will are also planned to move to DDR5 memory.
-=== 950 Series ===
-The Kunpeng 950 series will be the follow-up to the 930 and are planned for the 2023 timeframe.
 == See also ==
designer	HiSilicon + and ARM Holdings +
first announced	2014 +
full page name	hisilicon/kunpeng +
instance of	system on a chip family +
instruction set architecture	ARM +
main designer	HiSilicon +
manufacturer	TSMC +
name	Kunpeng +
technology	CMOS +
word size	64 bit (8 octets, 16 nibbles) +