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Below is a plot of percent of [[yield]] per wafer for a die of various sizes versus the same die consisting of two, three, and four chiplets. Note that an additional 10% overhead for the cross-die communication has been added to the chiplet-based design. | Below is a plot of percent of [[yield]] per wafer for a die of various sizes versus the same die consisting of two, three, and four chiplets. Note that an additional 10% overhead for the cross-die communication has been added to the chiplet-based design. | ||
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== Technologies == | == Technologies == |