Semiconductor & Computer Engineering
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Difference between revisions of "Template:10 nm comp header"
(Created page with "{| class="wikitable" style="float:left; margin:0; margin-right:-1px; font-family: monospace;" |- ! colspan="2" | |- ! style="text-align: right;" colspan="2" | Proce...") |
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! style="text-align: right;" colspan="2" | 1st Production | ! style="text-align: right;" colspan="2" | 1st Production | ||
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| + | ! style="text-align: center;" rowspan="3" | Lithography || style="text-align: right;" | Lithography | ||
| + | |- | ||
| + | ! style="text-align: right;" | Immersion | ||
| + | |- | ||
| + | ! style="text-align: right;" | Exposure | ||
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! style="text-align: center;" rowspan="2" | Wafer || style="text-align: right;" | Type | ! style="text-align: center;" rowspan="2" | Wafer || style="text-align: right;" | Type | ||
Revision as of 00:21, 5 April 2017
| Process Name | |
|---|---|
| 1st Production | |
| Lithography | Lithography |
| Immersion | |
| Exposure | |
| Wafer | Type |
| Size | |
| Transistor | Type |
| Voltage | |
| Fin | Pitch |
| Width | |
| Height | |
| Gate Pitch (Lg) | |
| Contacted Gate Pitch (CPP) | |
| Interconnect Pitch (M1P) | |
| SRAM bitcell | High-Perf (HP) |
| High-Density (HD) | |
| Low-Voltage (LV) | |
| DRAM bitcell | eDRAM |
