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Editing 7 nm lithography process
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==== N7+ ==== | ==== N7+ ==== | ||
− | The '''N7+ node''' is TSMC's first process technology to adopt [[EUV lithography]]. It is unrelated to | + | The '''N7+ node''' is TSMC's first process technology to adopt [[EUV lithography]]. It is unrelated to N7 nor N7P and is not IP-compatible with either, requiring re-implementation (new physical layout and validation). N7+ entered mass production in the second quarter of 2019 and uses EUV for four critical layers. Compared to TSMC N7 process, N7+ is said to deliver around 1.2x density improvement. N7+ is also said to deliver 10% higher performance at iso-power or, alternatively, up to 15% lower power at iso-performance. On paper, N7+ appears to be marginally better than N7P, albeit that comes at the cost of re-implementing the design. |
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