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| {{lithography processes}} | | {{lithography processes}} |
− | The '''500 nanometer (500 nm) lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[600 nm lithography process|600 nm process]]. Commercial [[integrated circuit]] manufacturing using 500 nm process began in 1992. 500 nm and was phased out and later replaced by [[350 nm]] in 1995. | + | The '''500 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[600 nm lithography process|600 nm process]]. Commercial [[integrated circuit]] manufacturing using 500 nm process began in 1992. 500 nm and was phased out and later replaced by [[350 nm]] in 1995. |
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| == Industry == | | == Industry == |
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| |Process Name | | |Process Name |
| |1st Production | | |1st Production |
− | |Metal Layers
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| |Contacted Gate Pitch | | |Contacted Gate Pitch |
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| {{scrolling table/mid}} | | {{scrolling table/mid}} |
| |- | | |- |
− | ! colspan="2" | [[Intel]] || colspan="2" | [[AMD]] || colspan="2" | [[DEC]] || colspan="2" | [[Fujitsu]] || colspan="2" | [[Hitachi]] || colspan="2" | [[HP]] || colspan="2" | [[IBM]] || colspan="2" | [[TI]] || colspan="2" | [[Motorola]] || colspan="2" | [[National Semiconductor|National]] (BiCMOS) | + | ! colspan="2" | [[Intel]] |
| |- style="text-align: center;" | | |- style="text-align: center;" |
− | | colspan="2" |P852 || colspan="2" | CS-24 || colspan="2" | CMOS-5 || colspan="2" | || colspan="2" | || colspan="2" | CMOS14C || colspan="2" | CMOS-5X || colspan="2" | || colspan="2" | HiPerMOS 1 || colspan="2" | ABiC V | + | | colspan="2" |P852 |
| |- style="text-align: center;" | | |- style="text-align: center;" |
− | | colspan="2" | 1994 || colspan="2" | 1993 || colspan="2" | 1993 || colspan="2" | 1994 || colspan="2" | 1994 || colspan="2" | 1996 || colspan="2" | 1994 || colspan="2" | 1995 || colspan="2" | 1995 || colspan="2" | | + | | colspan="2" |1994 |
− | |- style="text-align: center;"
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− | | colspan="2" | || colspan="2" | 3 || colspan="2" | 4 || colspan="2" | 3 || colspan="2" | 4 || colspan="2" | 5 || colspan="2" | 4 || colspan="2" | 4 || colspan="2" | || colspan="2" |
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− | ! Value !! [[800 nm]] Δ !! Value !! [[800 nm]] Δ !! Value !! [[800 nm]] Δ !! Value !! [[800 nm]] Δ !! Value !! [[800 nm]] Δ !! Value !! [[800 nm]] Δ !! Value !! [[800 nm]] Δ !! Value !! [[800 nm]] Δ !! Value !! [[800 nm]] Δ !! Value !! [[800 nm]] Δ
| + | ! Value !! [[800 nm]] Δ |
| |- | | |- |
− | | ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x
| + | | ? nm || ?x |
| |- | | |- |
− | | ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x
| + | | ? nm || ?x |
| |- | | |- |
− | | 44 µm² || 0.40x || ? µm² || ?x || ? µm² || ?x || ? µm² || ?x || ? µm² || ?x || ? µm² || ?x || ? µm² || ?x || ? µm² || ?x || ? µm² || ?x || ? µm² || ?x | + | | 44 µm<sup>2</sup> || 0.40x |
| {{scrolling table/end}} | | {{scrolling table/end}} |
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− | === DEC ===
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− | {{see also|dec/process|l1=DEC's Process Technology History}}
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− | DEC's half-micron process, '''CMOS-5''', which was used for their microprocessors such as the {{decc|Alpha 21164|l=arch}} used a Cabalt di-silicide in diffusion and poly with a channel length of 0.365 µm with a T<sub>OX</sub> of 9 nm along with 4 metal layers of AlCu (Aluminum Copper). The process had a Vtn/p = 0.5/-0.5 V and a supply voltage of 3.3 V.
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− | {| class="wikitable collapsible collapsed"
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− | |-
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− | ! colspan="3" | DEC's Design Rules
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− | |-
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− | ! Layer !! Pitch !! Thickness
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− | |-
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− | | M1 || 1.50 µm || 0.84 µm
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− | |-
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− | | M2 || 1.75 µm || 0.84 µm
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− | |-
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− | | M3 || 5.00 µm || 1.53 µm
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− | |-
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− | | M4 || 6.00 µm || 1.53 µm
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− | |}
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| == 500 nm Microprocessors == | | == 500 nm Microprocessors == |
− | * AMD
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− | ** {{amd|Am486}}
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− | ** {{amd|K5}} ("SSA/5" models only)
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− | * Cyrix
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− | ** {{cyrix|6x86}}
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− | * DEC
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− | ** {{decc|Alpha 21164}}
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− | ** {{decc|Alpha 21064A}}
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− | ** {{decc|Alpha 21164PC}}
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− | * Exponential
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− | ** {{expotech|X704}}
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− | * Fujitsu
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− | ** {{fujitsu|microSPARC II}} ("Swift")
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− | * Hitachi
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− | ** {{hitachi|harp-1}}
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− | * HP
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− | ** {{hp|PA-7200}} ("Thunderbird")
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− | ** {{hp|PA-7300LC}}
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− | ** {{hp|PA-8000}} ("Onyx", "Vulcan")
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− | * IBM
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− | ** {{ibm|PowerPC 601v}}
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− | ** {{ibm|PowerPC 602}}
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− | ** {{ibm|PowerPC 603}}
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− | ** {{ibm|PowerPC 603e}}
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− | * Intel
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− | ** {{intel|Pentium Pro}}
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− | * NexGen
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− | ** {{nexgen|Nx586}}
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− | * Qualcomm
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− | ** {{qualcomm|MSM2}}
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− | * Ross
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− | ** {{ross|hyperSPARC}} ("Colorado 2")
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| * Sun | | * Sun |
| ** {{sun|microSPARC II}}, 1994 | | ** {{sun|microSPARC II}}, 1994 |
− | ** {{sun|UltraSPARC}}
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| {{expand list}} | | {{expand list}} |
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| == 500 nm Microarchitectures == | | == 500 nm Microarchitectures == |
− | * AMD
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− | ** {{amd|K5|l=arch}}
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− | * DEC
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− | ** {{decc|Alpha 21164|l=arch}}
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− | * Intel
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− | ** {{intel|80186|l=arch}} (embedded [[IP cores]] only)
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| {{expand list}} | | {{expand list}} |
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− | [[category:lithography]]
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