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{{lithography processes}} | {{lithography processes}} | ||
− | The '''1.5 µm lithography process''' was the semiconductor process technology used by the major semiconductor companies in the mid 1980s | + | The '''1.5 µm lithography process''' was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. By the late 80s this process was replaced by [[1.3 µm]], [[1.2 µm]], and [[1 µm]] processes. |
== Industry == | == Industry == | ||
+ | Intel's 1.5 µm (''P646'') was done wit 125 mm wafers. A second enhanced version in 1985 was increased to a 150 mm wafer size. | ||
{{scrolling table/top|style=text-align: right; | first=Fab | {{scrolling table/top|style=text-align: right; | first=Fab | ||
|Process Name | |Process Name | ||
|1st Production | |1st Production | ||
+ | | | ||
|Contacted Gate Pitch | |Contacted Gate Pitch | ||
|Interconnect Pitch (M1P) | |Interconnect Pitch (M1P) | ||
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|SRAM bit cell | |SRAM bit cell | ||
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}} | }} | ||
{{scrolling table/mid}} | {{scrolling table/mid}} | ||
|- | |- | ||
− | ! [[Intel]] || [[Intel | + | ! [[Intel]] (CHMOS III) || [[Intel]] |
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | | | + | | P646 || P646 |
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | + | | 1982 || 1985 | |
|- | |- | ||
− | + | ! Value !! Value | |
|- | |- | ||
− | | ? nm | + | | ? nm || ? nm |
|- | |- | ||
− | | | + | | ? nm || ? nm |
|- | |- | ||
− | | ? | + | | ? µm<sup>2</sup> || ? µm<sup>2</sup> |
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{{scrolling table/end}} | {{scrolling table/end}} | ||
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== 1.5 µm Microprocessors == | == 1.5 µm Microprocessors == | ||
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* Intel | * Intel | ||
** {{intel|80286}} | ** {{intel|80286}} | ||
** {{intel|80386 DX}} | ** {{intel|80386 DX}} | ||
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− | [[ | + | [[Category:Lithography]] |