Heterogeneous Integration (HI) refers to the assembly and packaging of multiple separately manufactured components onto a single chip in order to improve functionality and enhance operating characteristics. Heterogeneous integration allows for the packaging of components of different functionalities, different process technologies, and sometimes separate manufacturers. The combined devices can vary in functionality (e.g., processors, signal processors, cache, sensors, photonics, RF, and MEMS) and technologies (e.g., one optimized for die size with another one optimized for low power).

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• Multi-Chip Package (MCP) is a package that incorporates multiple dice together with die-to-die interconnects going through the package substrate.
• Silicon Interposer is an added layer of silicon die that acts as an interpose between the dice and the package substrate underneath it.
• Wafer Level Fan-Out (WLFO)
• No TSV interposer/interconnect (NTI)
• Silicon-Less Integrated Module (SLIM)
• Embedded Multi-die Interconnect bridge (EMIB) involves inserting small silicon bridges inside the package substrate which interconnect the dice above using tighter pitched bumps while using normal bumps for the regular substrate.

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