Template:mpu Ryzen 7 1800X is a 64-bit octa-core top-of-the-line performance x86 desktop SoC introduced by AMD in early 2017. The 1800X is AMD's flagship model based on their Zen microarchitecture, fabricated on a 14 nm process. The 1800X operates at a base frequency of 3.6 GHz with a TDP of 95 W and a Boost frequency of 4.0 GHz. This MPU supports up to 64 GiB of dual-channel DDR4-2666 ECC memory.

Overview

Main article: Zen

The Ryzen 7 1800X is AMD's flagship system on chip based on the Zen microarchitecture. The 1800X integrates eight x86 cores and is the first AMD processor to support 2-way simultaneous multithreading. Sporting a base frequency of 3.6 GHz and a Boost frequency of 4.0 GHz, the 1800X is the fastest of the Ryzen processors. The 1800X is a complete SoC integrating a memory controller, along with much of the southbridge on-die. The 1800X includes 16 PCIe lanes for a GPU along with an NVMe controller and an additional 4 PCIe lanes for I/O along with SATA and USB 3.0 links.

Cache

Main article: Zen § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 768 KiB 786,432 B 0.75 MiB L1I$ 512 KiB 524,288 B 0.5 MiB 8x64 KiB 4-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 8x32 KiB 8-way set associative write-back L2$ 4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB     8x512 KiB 8-way set associative write-back L3$ 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB     2x8 MiB 16-way set associative

Memory controller

While officially supporting up to DDR4-2666, this processor can support much higher frequencies (3200 or even higher have been observed) with proper motherboard support. Additionally, while not officially supported, this processor also has ECC memory support (although it has not been validated for such capabilities).

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR4-2666 Supports ECC Yes Max Mem 64 GiB Controllers 1 Channels 2 Max Bandwidth 39.74 GiB/s 40,693.76 MiB/s 42.671 GB/s 42,670.5 MB/s 0.0388 TiB/s 0.0427 TB/s Bandwidth Single 19.87 GiB/s Double 39.74 GiB/s

[Edit] Memory Configurations
Dual Channel	Single Rank	2 DIMMs	DDR4-2666
		4 DIMMs	DDR4-2133
	Double Rank	2 DIMMs	DDR4-2400
		4 DIMMs	DDR4-1866

Expansions

[Edit/Modify Expansions Info]

	Expansion Options
	PCIe Revision 3.0 Max Lanes 20 Configs 1x16+1x4, 2x8+1x4, 1x8+3x4

Graphics

This processor has no integrated graphics.

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX MMX Extension EMMX Extended MMX Extension SSE Streaming SIMD Extensions SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSSE3 Supplemental SSE3 SSE4.1 Streaming SIMD Extensions 4.1 SSE4.2 Streaming SIMD Extensions 4.2 SSE4a Streaming SIMD Extensions 4a AVX Advanced Vector Extensions AVX2 Advanced Vector Extensions 2 ABM Advanced Bit Manipulation BMI1 Bit Manipulation Instruction Set 1 BMI2 Bit Manipulation Instruction Set 2 FMA3 3-Operand Fused-Multiply-Add AES AES Encryption Instructions RdRand Hardware RNG SHA SHA Extensions ADX Multi-Precision Add-Carry CLMUL Carry-less Multiplication Extension F16C 16-bit Floating Point Conversion x86-16 16-bit x86 x86-32 32-bit x86 x86-64 64-bit x86 Real Real Mode Protected Protected Mode SMM System Management Mode FPU Integrated x87 FPU NX No-eXecute SMT Simultaneous Multithreading AMD-Vi AMD-Vi (I/O MMU virtualization) AMD-V AMD Virtualization SenseMI SenseMI Technology XFR Extended Frequency Range

• This model has full XFR support, allowing for an additional +100 MHz boost frequency.

Die Shot

See also: Zen § Die Shot

• 14 nm process
• 12 metal layers
• 2,000 meters of signals
• 4,800,000,000 transistors
• 22.01 mm x 8.87 mm
• ~195.228 mm²