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Template:10 nm comp header
Revision as of 18:09, 19 March 2025 by 95.24.51.108 (talk) (fixed)
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Process Name
1st Production
Litho-
graphy 		Lithography
Immersion
Exposure
Wafer Type
Size
Tran-
sistor 		Type
Voltage
 
Fin Pitch
Width
Height
Gate Length (Lg)
Contacted Gate Pitch (CPP)
Minimum Metal Pitch (MMP)
SRAM
bitcell 		High-Perf (HP)
High-Density (HD)
Low-Voltage (LV)
DRAM
bitcell 		eDRAM
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