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Process Name
1st Production
Litho-
graphy
Lithography
Immersion
Exposure
Wafer Type
Size
Tran-
sistor
Type
Voltage
Metal Layers
 
Gate Length (Lg)
Contacted Gate Pitch (CPP)
Minimum Metal Pitch (MMP)
SRAM
bitcell
High-Perf (HP)
High-Density (HD)
Low-Voltage (LV)
DRAM
bitcell
eDRAM
Value