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AMD-K6/300BDZ - AMD
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Template:mpu AMD-K6/300BDZ was a 32-bit x86 mobile microprocessor designed by AMD and introduced in early 1998. This chip, which was based on AMD's new K6 microarchitecture, operated at 300 MHz and dissipated a maximum of 11 W.

Cache

Main article: K6 § Cache

L2$ can be 256 KB to 1 MB, depending on manufacturer and motherboard model. L2$ is off-chip.

Cache Info [Edit Values]
L1I$ 32 KB
"KB" is not declared as a valid unit of measurement for this property.
1x32 KB 2-way set associative
L1D$ 32 KB
"KB" is not declared as a valid unit of measurement for this property.
1x32 KB 2-way set associative

Graphics

This SoC has no integrated graphics processing unit.

Features

Template:mpu features

  • Auto-power down state
  • Stop clock state

Documents

DataSheet

Facts about "AMD-K6/300BDZ - AMD"
base frequency299.99 MHz (0.3 GHz, 299,990 kHz) +
bus rate66.66 MT/s (0.0667 GT/s, 66,660 kT/s) +
bus speed66.66 MHz (0.0667 GHz, 66,660 kHz) +
bus typeFSB +
clock multiplier4.5 +
core count1 +
core family5 +
core model7 +
core nameLittle Foot +
core voltage2.1 V (21 dV, 210 cV, 2,100 mV) +
core voltage tolerance5% +
cpuid570 +
designerAMD +
die area68 mm² (0.105 in², 0.68 cm², 68,000,000 µm²) +
familyK6 +
first announcedJanuary 1998 +
first launchedMarch 5, 1998 +
full page nameamd/k6/amd-k6/300bdz +
has locked clock multiplierfalse +
instance ofmicroprocessor +
io voltage3.3 V (33 dV, 330 cV, 3,300 mV) +
io voltage tolerance5% +
l1d$ description2-way set associative +
l1d$ size32 KiB (32,768 B, 0.0313 MiB) +
l1i$ description2-way set associative +
l1i$ size32 KiB (32,768 B, 0.0313 MiB) +
ldateMarch 5, 1998 +
manufacturerAMD +
market segmentMobile +
max case temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max cpu count1 +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max storage temperature423.15 K (150 °C, 302 °F, 761.67 °R) +
microarchitectureK6 +
min case temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature208.15 K (-65 °C, -85 °F, 374.67 °R) +
model numberAMD-K6/300BDZ +
nameAMD-K6/300BDZ +
packageCBGA-360 +
part numberAMD-K6/300BDZ +
power dissipation11 W (11,000 mW, 0.0148 hp, 0.011 kW) +
process250 nm (0.25 μm, 2.5e-4 mm) +
seriesMobile K6 +
smp max ways1 +
technologyCMOS +
thread count1 +
transistor count8,800,000 +
word size32 bit (4 octets, 8 nibbles) +