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Core i3-6100H - Intel
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Template:mpu Core i3-6100H is a 64-bit dual-core low-end mobile microprocessor introduced by Intel late 2015. This processor, which is based on the Skylake microarchitecture and manufactured in 14 nm process, has a base frequency of 2.7 GHz with a TDP of 35 W. This processor incorporates the HD Graphics 530 GPU clocked at 350 MHz with a max frequency of 900 MHz.

Cache

Main article: Skylake § Cache
Cache Info [Edit Values]
L1I$ 64 KB
"KB" is not declared as a valid unit of measurement for this property.
 		2x32 KB 8-way set associative (per core, write-back)
L1D$ 64 KB
"KB" is not declared as a valid unit of measurement for this property.
 		2x32 KB 8-way set associative (per core, write-back)
L2$ 512 KB
"KB" is not declared as a valid unit of measurement for this property.
 		2x256 KB 4-way set associative (per core, write-back)
L3$ 3 MB
"MB" is not declared as a valid unit of measurement for this property.
 		shared

Graphics

Integrated Graphic Information
GPU Intel HD Graphics 530
Device ID 0x191B
Displays 3
Frequency 350 MHz
0.35 GHz
350,000 KHz
Max frequency 900 MHz
0.9 GHz
900,000 KHz
Max memory 64 GB
"GB" is not declared as a valid unit of measurement for this property.
Output DisplayPort, Embedded DisplayPort, HDMI, DVI
DirectX 12
OpenGL 4.4
OpenCL 2.0
HDMI 1.4a
DP 1.2
eDP 1.3
Max HDMI Res 4096x2304 @24 Hz
Max DP Res 4096x2304 @60 Hz
Max eDP Res 4096x2304 @60 Hz
Intel Quick Sync Video
Intel InTru 3D
Intel Insider
Intel WiDi (Wireless Display)
Intel Clear Video

Memory controller

Integrated Memory Controller
Type DDR3L-1600, LPDDR3-1866, DDR4-2133
Controllers 1
Channels 2
ECC Support No
Max bandwidth 34.1 GB/s
Max memory 64 GB

Expansions

Template:mpu expansions

Features

Template:mpu features

Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_i3/i3-6100h&oldid=18728"
Facts about "Core i3-6100H - Intel"
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Core i3-6100H - Intel#package + and Core i3-6100H - Intel#io +
base frequency2,700 MHz (2.7 GHz, 2,700,000 kHz) +
bus links4 +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
clock multiplier27 +
core count2 +
core family6 +
core model94 +
core nameSkylake H +
core steppingR0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x191B +
die area98.57 mm² (0.153 in², 0.986 cm², 98,570,000 µm²) +
die length10.3 mm (1.03 cm, 0.406 in, 10,300 µm) +
die width9.57 mm (0.957 cm, 0.377 in, 9,570 µm) +
familyCore i3 +
first announcedSeptember 1, 2015 +
first launchedSeptember 27, 2015 +
full page nameintel/core i3/i3-6100h +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Enhanced SpeedStep Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel supervisor mode execution protectiontrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 530 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ size3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
last orderApril 19, 2019 +
last shipmentOctober 18, 2019 +
ldateSeptember 27, 2015 +
main imageFile:skylake h (front).png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels2 +
max operating temperature100 °C +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureSkylake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min operating temperature0 °C +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi3-6100H +
nameCore i3-6100H +
packageFCBGA-1440 +
part numberCL8066202194634 +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 225.00 (€ 202.50, £ 182.25, ¥ 23,249.25) +
s-specSR2FR +
seriesi3-6000 +
smp max ways1 +
supported memory typeLPDDR3-1866 +, DDR3L-1600 + and DDR4-2133 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +