Process Name
1st Production
Litho- graphy	Lithography
	Immersion
	Exposure
Wafer	Type
	Size
Tran- sistor	Type
	Voltage
Fin	Pitch
	Width
	Height
Gate Length (Lg)
Contacted Gate Pitch (CPP)
Minimum Metal Pitch (MMP)
SRAM bitcell	High-Perf (HP)
	High-Density (HD)
	Low-Voltage (LV)
DRAM bitcell	eDRAM

Value